COMSOL Conference 2009 Milan

The European COMSOL Conference 2009 took place in Milan (Italy) on October 14-16. We would like to extend our gratitude to each and everyone of the attendees whose contributions were indispensable in making this conference a great success.

Click here to see what the conference attendees thought about the event.

Awards Winners

Best Papers

Multiphysics Modelling of a Micro Valve
F. Bircher and P. Marmet
Bern University of Applied Sciences, Institute of Print Technology, Switzerland

Multiphase, Dual Polymer Injection Molding and Cooling of an Open Cavity to Form both Distinct and Graduated Material Properties within a Complex Three-Dimensional Body
M. S. Yeoman
Continuum Blue Ltd, United Kingdom

Numerical Simulation of Granular Solids' Behaviour: Interaction with Gas
A. Zugliano¹, R. Artoni², A. Santomaso², A. Primavera^1
1 Danieli & C. Officine Meccaniche S.p.a.- Italy
² Università di Padova DIPIC - Italy

Best Poster

Dynamic Observation of Magnetic Particles in Continuous Flow Devices by Tunneling Magnetoresistance Sensors
Alexander Weddemann
Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

COMSOL Conference CD

Don't miss the chance to take a look a the collection of all papers and presentations from the COMSOL Conference 2009 in Boston, Milan and Bangalore.

The COMSOL Conference CD is available free of charge. Click here to request your free copy!

The Conference in Numbers

• 420 attendees
• 140 User Presentations
• 65 Posters
• 20 Conference Sponsors
• 20 Minicourses & Tutorials
• 10 Keynote talks