COMSOL Multiphysics Seminar

Urbana, IL - July 25, 2014: Join us for this unique opportunity to advance your skills in multiphysics simulation. This seminar includes a specialized session focusing on heat transfer applications and structural mechanics. You will leave with new skills to work on your own applications using your free, two-week COMSOL trial.

2:00pm - 3:30pm Structural Mechanics
Learn about the range of COMSOL's capabilities for modeling of structures. We will address:
  • Contact modeling
  • Nonlinear material properties
  • Shells, Membranes, Beams, and Trusses
  • Modeling of mechanisms
  • Fatigue and Creep analysis
  • Coupling to other physics, such as fluid-structure interactions
3:30pm - 5:00pm Heat Transfer
Find out about COMSOL’s capabilities for thermal analysis. We will cover:
  • Conduction, the transfer of heat through solids
  • Convection, the transport of heat by moving fluids via the coupling to flow simulations
  • Radiation, the transfer of heat via infrared
  • How to couple these analyses together, and to other physics such as structural mechanics, electromagnetics, and chemical reaction modeling


July 25, 2014
2:00pm - 5:00pm

University of Illinois at Urbana-Champaign
2240 Digital Computer Laboratory
1304 West Springfield Ave.
Urbana, IL
*This seminar is part of the Elements of Integrated Computational Materials Engineering (ICME) Research Workshop. Please note, the COMSOL Multiphysics portion of the event is free of charge.


Temesgen Kindo

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