COMSOL Multiphysics Seminar

Urbana, IL - July 25, 2014: Join us for this unique opportunity to advance your skills in multiphysics simulation. This seminar includes a specialized session focusing on heat transfer applications and structural mechanics. You will leave with new skills to work on your own applications using your free, two-week COMSOL trial.

2:00pm - 3:30pm Structural Mechanics
Learn about the range of COMSOL's capabilities for modeling of structures. We will address:
  • Contact modeling
  • Nonlinear material properties
  • Shells, Membranes, Beams, and Trusses
  • Modeling of mechanisms
  • Fatigue and Creep analysis
  • Coupling to other physics, such as fluid-structure interactions
3:30pm - 5:00pm Heat Transfer
Find out about COMSOL’s capabilities for thermal analysis. We will cover:
  • Conduction, the transfer of heat through solids
  • Convection, the transport of heat by moving fluids via the coupling to flow simulations
  • Radiation, the transfer of heat via infrared
  • How to couple these analyses together, and to other physics such as structural mechanics, electromagnetics, and chemical reaction modeling

Details

July 25, 2014
2:00pm - 5:00pm

University of Illinois at Urbana-Champaign
2240 Digital Computer Laboratory
1304 West Springfield Ave.
Urbana, IL
*This seminar is part of the Elements of Integrated Computational Materials Engineering (ICME) Research Workshop. Please note, the COMSOL Multiphysics portion of the event is free of charge.


Speaker

Temesgen Kindo
COMSOL, Inc.


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