New Release Highlights in COMSOL 3.4

COMSOL brings a major upgrade to its customers that includes multicore support, new solvers, and many enhancements to the add-on modules. These reinforce COMSOL Multiphysics’ position in the FEA market and cement it as the primary tool for multiphysics modeling.

Multicore processing slashes time to solution

COMSOL Multiphysics 3.4 delivers the utmost in computational speed by leveraging multicore processors and shared-memory parallelism. Every step of the simulation workflow—meshing, assembly, and solving—now executes in parallel.

New segregated solver and stabilization techniques
increase model-size to be solved

A segregated solver with an easy-to-use interface reduces memory consumption significantly when computing large problems, such as fluid-structure interaction (FSI) or wave propagation in thermally deformed structures.

A major upgrade to COMSOL Multiphysics’s iterative methods pushes solver performance for fluid dynamics to new heights. New, state-of-the-art Galerkin Least Squares (GLS) stabilization techniques now complement COMSOL’s iterative solvers, enabling large fluid flow problems with millions of degrees of freedom to be solved.

Multiphase flow

The Chemical Engineering Module has been improved with a powerful modeling interface for the simulation of multiphase flow. With it, users can now simulate bubbly flows, such as in scrubbers, and also set up mixture models for simulating emulsification, sedimentation, and other separation processes.

COMSOL Multiphysics 3.4 Highlights

• Parallelized meshing, assembly, and solving on multicore and multiprocessor computers
• Memory-efficient fluid flow solvers for chemical engineering, heat transfer, and microfluidics
• Segregated solver minimizes memory consumption for large multiphysics problems
• Improved post-processing including geometric properties such as center of gravity
• Easy modeling of electronics cooling and free convection with interfaces for variable-density flow
• Boundary layer meshing for representing boundary layers in fluid flow, heat transfer, and electromagnetics
• Bubbly flow interfaces for modeling of scrubbers, aerators, bioreactors, food processing equipment, and boiling
• Mixture-model two-phase flow interfaces for simulation of emulsification, sedimentation and separation processes as well as fluidized beds
• Nonlinear parameter estimation
• Piezoacoustic multiphysics modeling of microphones, ultrasonic transducers and MEMS devices
• Full-wave 3D RF analysis of printed circuit boards and transmission lines with lumped port boundary conditions
• Fatigue analysis

To read a full list of all new features and models in COMSOL 3.4, visit www.comsol.com/products/features/3.4/