Model Gallery

The Model Gallery features COMSOL Multiphysics model files from a wide variety of application areas including the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use models and step-by-step instructions for building the model, and use these as a starting point for your own modeling work. Use the Quick Search to find models relevant to your area of expertise, and login or create a COMSOL Access account that is associated with a valid COMSOL license to download the model files.

Friction Stir Welding of an Aluminum Plate

In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model, two aluminum plates are joined by generating friction heat with a rotating tool. Heat is transferred by conduction from the tool into the plates. The movement of ...

Surface Resistor: Thermo-Mechanical Analysis

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the ...

RF-Heated Hot Wall Furnace for Semiconductor Processing

Furnace reactors are used in the fabrication of semiconductors to grow layers on wafers. These can also be used for epitaxial growth, which is a key technology for fabrication of electrical devices. A silicon carbide growth takes place in graphite susceptors at very high temperatures (~2000 oC), which are heated with RF coils. The design of the chamber is crucial to reach a uniform ...

Copper Layer on Silica Glass

In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must therefore account for a highly conductive layer. This is done, using a the Highly Conductive Layer feature in ...

Simulation of Multiphysics Contact in a Power Conductor

This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a cylindrical body and plate hook shapes at the contact area. There, the thermal and electrical apparent resistances are ...

Using the Curvilinear Coordinate Interface for Heat Transfer Modeling

This model and presentation shows how to model anisotropic properties of fibers in a heat transfer simulation. Because the fibers orientation is not easy to define explicitly, the curvilinear coordinate interface is used to define the fiber orientation. The fibers have high thermal conductivity in the fiber direction and low conductivity in the perpendicular direction.

Heat Conduction in a Cylinder

This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin instead of degrees Celsius for this model.

Power Transistor

In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a system consisting of a small part of a circuit board containing a power transistor and the copper pathways ...

Thermal Contact Resistance Between an Electronic Package and a Heat Sink

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the device depends on the cooling of the fins and the heat transfer from the package to the heat sink. This model ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

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