Model Gallery

The Model Gallery features COMSOL Multiphysics model files from a wide variety of application areas including the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use models and step-by-step instructions for building the model, and use these as a starting point for your own modeling work. Use the Quick Search to find models relevant to your area of expertise, and login or create a COMSOL Access account that is associated with a valid COMSOL license to download the model files.

Power Transistor

In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a system consisting of a small part of a circuit board containing a power transistor and the copper pathways ...

Simulation of Multiphysics Contact in a Power Conductor

This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a cylindrical body and plate hook shapes at the contact area. There, the thermal and electrical apparent resistances are ...

Heating of a Slab

This simple example covers the heating of a finite slab and how the temperature varies with time. We will set up the problem in COMSOL Multiphysics after which we compare the solution to the analytical solution.

Temperature Field in a Cooling Flange

A cooling flange in a chemical process is used to cool the process fluid, which flows through the flange. The surrounding air cools the flange via natural convection. In the stationary model, the forced convection to the process fluid is modeled using a constant heat transfer coefficient. The natural convection cooling is modeled using tabulated empirical transfer coefficients that are ...

Buoyancy Flow in Water

This example studies the stationary state of free convection in a cavity filled with water and bounded by two vertical plates. To generate the buoyancy flow, the plates are heated at different temperatures, bringing the regime close to the transition between laminar and turbulent. To prepare the model, an estimation of the flow regime is performed using the Reynolds, Grashof, Rayleigh and ...

Radiative Heat Transfer in a Utility Boiler

This model uses the discrete-ordinates method (DOM) to analyze the radiative heat transfer in a utility boiler with internal obstacles. DOM is one of the most useful radiation models for prediction of radiative heat fluxes on the furnace walls of a combustion chamber. With this model, the behavior of the temperature and heat flux within the furnace and on the heat surfaces can be easily obtained ...

Thermal Performances of Windows

During the design of a building, environmental issues have gained considerable influence in the entire project. One of the first concerns is to improve thermal performances. In this process, simulation software are key tools to model thermal losses and performances in the building. The international standard ISO 10077-2:2012 deals with thermal performance of windows, doors and shutters. It ...

Composite Thermal Barrier

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin thermally resistive layer boundary condition is used to avoid resolving the thin domains. The technique is useful when modeling heat transfer through thermal barriers like multilayer coatings.

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat-producing devices, so that the sensitive ones do not overheat. One type of heat-generating device is a ...

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