Model Gallery

The Model Gallery features COMSOL Multiphysics model files from a wide variety of application areas including the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use models and step-by-step instructions for building the model, and use these as a starting point for your own modeling work. Use the Quick Search to find models relevant to your area of expertise, and login or create a COMSOL Access account that is associated with a valid COMSOL license to download the model files.

Thermal Contact Resistance Between an Electronic Package and a Heat Sink

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the device depends on the cooling of the fins and the heat transfer from the package to the heat sink. This model ...

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat-producing devices, so that the sensitive ones do not overheat. One type of heat-generating device is a ...

Thermophoresis

When a temperature gradient in a gas exists, suspended particles will tend to move from regions of high temperature to low. The force which produces this effect is called the thermophoretic force. Gas molecules colliding with a particle from the hot side have a higher velocity than the cold side, which results in a net force towards cold areas. This effect can be exploited to create thermal ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Temperature Field in a Cooling Flange

A cooling flange in a chemical process is used to cool the process fluid, which flows through the flange. The surrounding air cools the flange via natural convection. In the stationary model, the forced convection to the process fluid is modeled using a constant heat transfer coefficient. The natural convection cooling is modeled using tabulated empirical transfer coefficients that are ...

Buoyancy Flow in Water

This example studies the stationary state of free convection in a cavity filled with water and bounded by two vertical plates. To generate the buoyancy flow, the plates are heated at different temperatures, bringing the regime close to the transition between laminar and turbulent. To prepare the model, an estimation of the flow regime is performed using the Reynolds, Grashof, Rayleigh and ...

Heating of a Slab

This simple example covers the heating of a finite slab and how the temperature varies with time. We will set up the problem in COMSOL Multiphysics after which we compare the solution to the analytical solution.

Cross-Flow Heat Exchanger

This model solves the fluid flow and heat transfer in a micro heat exchanger made of stainless steel. These types of heat exchangers are found in lab-on-chip devices in biotechnology and micro reactors, for example for micro fuel cells. The model takes heat transferred through both convection and conduction into account. A square cross-section is used for the fluid channels instead of circular ...

Composite Thermal Barrier

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin thermally resistive layer boundary condition is used to avoid resolving the thin domains. The technique is useful when modeling heat transfer through thermal barriers like multilayer coatings.

Thermal Modeling of a Microchannel Heat Sink

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, require a heat sink with cooling fins that are exposed to forced air from a fan. This discussion develops ...

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