Model Gallery

The Model Gallery features COMSOL Multiphysics model files from a wide variety of application areas including the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use models and step-by-step instructions for building the model, and use these as a starting point for your own modeling work. Use the Quick Search to find models relevant to your area of expertise, and login or create a COMSOL Access account that is associated with a valid COMSOL license to download the model files.

Shell Conduction

This model simulates a static analysis of heat conduction in a thin conductive shell. This is a benchmark model where the result is compared with a NAFEMS benchmark solution.

Small Signal Analysis of a MOSFET

This model shows how to compute the AC characteristics of a MOSFET. Both the output conductance and the transconductance are computed as a function of the drain current.

Rigid Body Motion using the Level Set Method

This model demonstrates how you can use the Level Set method and application mode to track an interface in a given velocity field. It also shows how the choice of the level set parameters influence the solution.

Pinched Hemispherical Shell

This example studies the deformation of a hemispherical shell, where the loads cause significant geometric nonlinearity. The maximum deflections are more than two magnitudes larger than the thickness of the shell. The problem is a standard benchmark, used for testing shell formulations in a case which contains membrane and bending action, as well as large rigid body rotation.

Notch Approximation to Low Cycle Fatigue Analyis of Cylinder with a Hole

A load carrying component of a structure is subjected to multi-axial cyclic loading during which localized yielding of the material occurs. In this model you perform a low cycle fatigue analysis of the part based on the Smith-Watson-Topper (SWT) model. Due to localized yielding, you can use two methods to obtain the stress and strain distributions for the fatigue evaluation. The first method ...

Distributed SPICE Model of Bipolar Transistor

Integrated semiconductor devices are used in almost all electrical equipment, and the bipolar junction transistor (BJT) is still a very important device although the MOS technology has taken over a large part of the market. Especially in technologies with new types of semiconductors the bipolar transistor can be the best choice for optimum performance. The BJT consists of three semiconductor ...


Multipaction can occur when electrons are accelerated by a high frequency RF field into surfaces. Secondary electron emission can occur and under the right conditions there can be an exponential growth in the number of electrons. The multipaction effect is strongest at a specific RF frequency, which depends on the dimensions of the device and the applied voltage.\n\nThis model requires the ...

Finite Well

This model defines transient flow to a well of finite radius in a confined aquifer. The results from this analysis are compared to the well known Theis solution for flow to a point well. What distinguishes this model from the Theis problem is the well geometry. Since the analytic solution describes the well as a point source which produces unphysical results inside the wellbore. The COMSOL ...

Wrapped Thick Cylinder under Pressure and Thermal Loading

This model is compared to a NAFEMS benchmark for composite material modeling, No R0031/2. The geometry is a long, thick, and hollow cylinder consisting of two layers, where an internal pressure is applied. The inner layer is made from an isotropic material, while the outer layer is made from an orthotropic material. This material's properties are equal in the radial and axial directions, yet ...

Thermal Bridges in Building Construction—3D Structure Between Two Floors

This model studies the heat conduction in a building structure separating two floors from the external environment. Four materials with distinct thermal conductivities k compose the structure. The exterior and interior boundaries are facing environments respectively at 0°C and 20°C. The lowest temperatures on internal surfaces and the heat fluxes through each surface is compared with published ...

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