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Study of Tertiary Current Distributions on the Wafer in a Plating Cell


L. Tong1
1Keisoku Engineering System Co., Ltd,. Chiyoda-ku, Tokyo, Japan


Surface velocity magnitude from plating cell simulation.

The reciprocating paddle cell is a known practical method for depositing alloy films on wafer substrates. Recently, the mass transfer boundary layer within an industrial wafer plating cell was studied based on the measurement of limiting current. It was indicated that a shear-plate fluid agitation mechanism is capable of generating a thin (i.e.

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