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Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process

T. Soares1 H. Mozaffari2 H. Reinecke1
1Universität Freiburg, Freiburg im Breisgau, BW, Germany
2Hochschule Furtwangen, Tuttlingen, BW, Germany

3D simulation of grain structures growth.

The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase crystals. Afterwards, the entire surface was covered with a polymer coat, and after drying, a polishing process was conducted in order to develop the pre-defined pattern, consisting of conductive and electrically insulated regions, which are confined to the crystal dimensions. Finally, microstructure patterns were generated through electrodeposition.

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