Multiphysics Simulations for the Design of Probe-Heads Micro-Needles
A. Corigliano1 A. Courard1 G. Cocchetti1 P. Gagliardi1 L. Magagnin1 R. Vallauri2 D. Acconcia2
1Politecnico di Milano, Milano, Italy
2Technoprobe, Cernusco Lombardone, Italy
The paper presents recent results concerning the experimental mechanical characterization, the numerical modeling and the design of micro-needles used in the construction of probe heads for wafer testing. A fully coupled electro-thermal model was created using COMSOL and combined to a research-oriented thermo-mechanical Finite Element (FE) code in order to accurately reproduce the micro-needle behavior under constant load and varying current intensity. The numerical simulations put in evidence the influence of the presence of a set of micro-needles on the temperature distribution.