Design of heat flux microsensor assisted by COMSOL for the study of energy transfer on Si and Cu thin samples

L. Bedra, N. Semmar, A.-L. Thomann, R. Dussart, J. Mathias, and Y. Tessier
GREMI, CNRS-Université d'Orléans, Orléans, France

A commercial heat probe is used for energy transfer measurements on copper and silicon substrates. To do so, the micro sensor has to be calibrated under high vacuum (~10-7 mbar), using a homemade black body as a heat source.

Although the HFM is cooled at 5 oC, the solid surface temperature is unknown as the thermal contact resistance.

Thus, COMSOL simulations are also used to obtain reliable temperature in all part of the substrate, while thermal resistance is varied.