Modeling and Analysis of Thermal Bimorph using COMSOL Multiphysics®Rachita Shettar, Dr. B G. Sheparamatti
Basaveshwar Engineering College, Bagalkot, Karanataka, India
In this paper modeling and simulation results of a thermal bimorph is capable of producing increased displacement for increasing temperatures are presented. Thermal bimorphs are popular actuation technology in MEMS (Micro-Electro-Mechanical Systems). Bimorph actuators consist of two materials with different coefficients of thermal expansion. The main objective of this work is to investigate the deformation in bimorph actuator for varying temperatures. Deformation increases with increase in length of actuator. Thus, temperature produces thermal strain and thermally induced deformation this makes the microstructure into a thermal actuator.
The simulation and analytical results are also compared. Their operating principle is based on differential thermal expansion induced by Joule heating and thermal expansion. Thermal actuators have been used in applications, like micro grippers.