Multiphysics Simulations for the Design of Probe-Heads Micro-Needles

A. Corigliano[1], A. Courard[1], G. Cocchetti[1], P. Gagliardi[1], L. Magagnin[1], R. Vallauri[2], D. Acconcia[2]
[1]Politecnico di Milano, Milano, Italy
[2]Technoprobe, Cernusco Lombardone, Italy

The paper presents recent results concerning the experimental mechanical characterization, the numerical modeling and the design of micro-needles used in the construction of probe heads for wafer testing. A fully coupled electro-thermal model was created using COMSOL and combined to a research-oriented thermo-mechanical Finite Element (FE) code in order to accurately reproduce the micro-needle behavior under constant load and varying current intensity. The numerical simulations put in evidence the influence of the presence of a set of micro-needles on the temperature distribution.