Thermal Model of a Radiosonde System

E. Javier[1], J. Alberto Bava[1], and G. Rodriguez[2]
[1]Facultad de Ingenieria Universidad Nacional de La Plata, La Plata, Buenos Aires, Argentina.
[2]Facultad de Astronomia y Ciencias Geofisicas Universidad Nacional de La Plata, La Plata, Buenos Aires, Argentina.

This paper describes the development of a thermal model applied to a radiosonde system that calculates the average temperature on the printed circuit board PCB of the system.

Using the thermal physics module called \"Conjugated Heat Transfer” of the COMSOL utility, simulations are performed which allow modeling the atmospheric conditions of the environment that the radiosonde will be exposed. Based on this analysis, materials and geometry are chosen for a proper thermal insulation which will allow the correct operation of electronic circuits of the system.

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