Finite Element Analysis of Electro-mechanical Deflection of Cantilevers for SPM and MEMS Applications
D. Moro, and G. Valdrè
University of Bologna
The understanding of the distribution of electrostatic forces at the nanoscale is of fundamental importance for the development of nanotechnology. In this work, in order to quantify the EFM cantilever/tip-sample interaction, we present a 3D static Finite Element Analysis of the electromechanical interaction between conductive probes and samples, using COMSOL Multiphysics. The simulation ...
E. Giuri, A. Ricci, and C. Ricciardi
Laboratorio di Technologie Elettrobiochimiche Miniaturizzate per l'Anilisi e la Ricerca, Politechnico di Torino
Finite Element Method simulations of microstructure behaviour is carried out by COMSOL. This enables us to make also technological considerations related to the easy way of fabrication and to lower production costs as explained in the following slide.
C. Boffo, C. Cooper, G. Galasso, and A. Rowe
 FNAL, Batavia, IL 60510, U.S.A.
 Università degli Studi di Udine
Buffer chemical polishing is a cheap, simple and effective processing technique for single grain high gradient and polycrystalline lower gradient cavities. This paper describes the thermal-fluid finite element model adopted to simulate the process, the experimental flow visualization tests performed to verify the simulation and a novel device fabricated to solve the problem.
Simulation of the Inverse Extrusion of a Brass Rod by the Coupling of Fluid, Mechanical, Thermal and Ale Modules
C. Mapelli, and L. Bergami
Politecnico di Milano
An efficient simulation of the inverse extrusion process has been performed through the coupling of three modules in COMSOL Multiphysics: fluid-dynamics, general heat transfer and ALE. The strain, the strain rate, and the stress field can be completely defined after the complete definition of the velocity field of the material under the action of the tool. The definition of the stresses and of ...
L. Martinelli, and P. Ruol
 Università di Bologna
 IMAGE, Università di Padova
This paper describes an example of full fluid structure interaction. The 2D dynamics of a box-type pile-anchored floating breakwater is solved by means of two models using COMSOL Multiphysics . Simulated wave transmission and vertical displacements of the floating breakwater agree well with physical model results.
N. Bianco, O. Manca, and D. Ricci
Università degli Studi di Napoli
A numerical analysis of the conjugate optical-thermal fields in an amorphous silicon thin film deposited on a glass substrate and irradiated by a moving Gaussian laser source is carried out. The combined optical and thermal models are solved by means of COMSOL Multiphysics. Results are given for continuous and pulsed moving Gaussian heat sources and they are presented as temperature ...
F. Cipitì, L. Pino, A. Vita, M. Laganà, and V. Recupero
This paper presents a two dimensional model of a Preferential Oxidation Reactor. The main aim of the mathematical model was to investigate the process performance of the reactor by parametric analysis. Temperature and concentration profiles along the length of the reactor were evaluated in order to enhance optimization and control of the PROX unit.
Politecnico di Torino
In this paper, a model of a tubular fuel cell is proposed and includes thermo-fluid dynamics, chemical reactions and electrochemistry. The main results presented are the temperature distribution, the concentration of species and the polarization curves.
M.V. De Bonis, and G. Ruocco
CFDfood, DITEC, Università degli studi della Basilicata, Potenza
The present work exploits modelling of a heat exchanger single channel during the pasteurization of milk. A 2D computation has been performed with COMSOL Multiphysics showing the potential application to optimized geometries and for a variety of products of known biochemical evolution.
A. Ricci, E. Giuri, and C. Ricciardi
Microcantilevers made of crystal silicon are probably the most diffused type of MEMS because of their simple fabrication and their vast applications. In this presentation we treat the mechanical behaviour of silicon mirocantilevers, and also give an overview of the many application areas that these apply to.