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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Hyperbolic Heat Transfer Equation for Radiofrequency Heating: Comparison between Analytical and COMSOL Solutions

V. Romero-García[1], M. Trujillo[2], M.J. Rivera[2], J.A. López Molina[2], and E.J. Berjano[3]
[1]Centro de Tecnologías Físicas Acústica, Universidad Politécnica de Valencia, Valencia, Spain
[2]Dpto. Matemática Aplicada, Instituto Universitario de Matemática Pura y Aplicada, Universidad Politécnica de Valencia, Valencia, Spain
[3]Institute for Research and Innovation on Bioengineering, Universidad Politécnica de Valencia, Valencia, Spain

The Radiofrequency Heating (RFH) is widely employed to heat biological tissue in different surgical procedures. Most models analyze the RFH employing a Parabolic Heat Transfer Equation (PHTE) based on Fourier's theory. The PHTE can be used for problems involving long heating times or low thermal gradients. However, when the problem involves short heating times or extreme thermal gradients it is ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Fast 2D Simulation of Superconductors: A Multiscale Approach

V.M. Rodriguez-Zermeno[1], M.P. Sørensen[1], N.F. Pedersen[2], N. Mijatovic[2], and A.B. Abrahamsen[3]
[1]DTU Mathematics, Lyngby, Denmark
[2]DTU Electrical Engineering, Lyngby, Denmark
[3]Materials Research Division, Risø, DTU, Roskilde, Denmark

This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...

Inductance of Magnetic Plated Wires as a Function of Frequency and Plating Thickness

T. Graf[1], O. Schälli[1], A. Furrer[1], and P. Marty[1]

[1]Technik und Architektur, Hochschule Luzern, Horw, Switzerland

This paper analyzes the magnetic behavior of electroplated wires. For this purpose the resistance and inductance of single turn loops and coils have been simulated and measured. The measurement is delicate due to the influence of a stray capacitance. We show that the quality factor of magnetic plated loops and coils can be tuned easily by the plating thickness. In addition the quality factor of ...

Classical Models of the Interface Between an Electrode and an Electrolyte

E. Gongadze[1], S. Petersen[1], U. Beck[2], and U. van Rienen[1]
[1]Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
[2]Institute of Electronic Appliances and Circuits, University of Rostock,
Rostock, Germany

The Electrical Double Layer (EDL) plays a major role in understanding the interface between a charged surface (e.g. an implant) and ionic liquids (e.g. body fluids). The three classical models of the EDL (Helmholtz, Gouy, and Chapman-Stern) are numerically solved for a flat surface electrode in the 3D Electrostatics application mode of COMSOL Multiphysics® 3.5a. The values of the electric ...

An Acoustical Finite Element Model of Perforated Elements

P. Bonfiglio[1][2] and F. Pompoli[1][2]
[1]Materiacustica S.r.l., Ferrara, Italy
[2]Engineering Department, University of Ferrara, Ferrara, Italy

The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...

Mathematical Modeling of Zig-Zag Traveling-Wave Electro-Osmotic Micropumps

J. Hrdlicka[1], P. Cervenka[1], M. Pribyl[1], and D. Snita[1]
[1]Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic

In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. The ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

Calculus of the Elastic Properties of a Beam Cross Section

A. Genoese[1], A. Genoese[1], and G. Garcea[1]
[1]Dipartimento di Modellistica per l'Ingegneria, Università della Calabria, Arcavacata di Rende, CS, Italy

Saint-Venant general rod theory is used to calculate the elastic factors of a section through the numerical solution of a system of partial differential equations. The elastic properties so evaluated are used in a geometric nonlinear analysis of 3D beam structures with general cross-section to calculate some important quantities such as the stiffness matrix. Linear solutions, such as the ...