Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Screening Effects in Probing the Electric Double Layer by Scanning Electrochemical Potential Microscopy

R.F. Hamou[1], P.U. Biedermann[1], A. Erbe[1], and M. Rohwerder[1]
[1]Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Germany

A computational method is developed to study probing the electric double layer by Scanning Electrochemical Potential Microscopy. The model is based on a modified Poisson- Boltzmann equation, which takes into account steric effects. We investigated the effect of metallic apex protrusion and the Open Circuit Potential (OCP) of the tip on the probed potential. A clear electrostatic screening effect ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

A Magnetohydrodynamic Study of a Inductive MHD Generator

A. Montisci[1] and R. Pintus[1]

[1]Department of Electrical and Electronic Engineering, University of Cagliari, Cagliari, Italy

The aim of the proposed device is to overcome the typical drawbacks of MHD generators, such as the needed of a very high external magnetic field, the strong dependency of the efficiency by the temperature of the fluid, and the deterioration of the electrodes that are in contact with the high temperature plasma. In fact the proposed device does not need an external magnetic fluid to work, but it ...

3-D COMSOL Analysis of Extruder Dies

E. Solomon[1] and V. Mathew[1]
[1]Arcada University of Applied Sciences, Espoo, Finland

Three-dimensional flow analysis was performed by using COMSOL Multiphysics Chemical Engineering Module for the purpose of analyzing the flow properties and finding out the operating points of a test domain. Using material property table for an exemplary melt of LDPE (Low-Density Polyethylene), the logarithmic viscosity-shear rate graph was plotted and fitted to the 4–constant modified Carreau ...

Static and Dynamic Simulation of an Electromagnetic Valve Actuator Using COMSOL Multiphysics®

R. Wislati[1] and H. Haase[1]
[1]Institut für Grundlagen der Elektrotechnik und Messtechnik, Leibniz Universität Hannover, Hannover, Germany

In this paper an Electromagnetic Solenoid Actuator (EMVA) consisting of an upper and lower electromagnet, a linear moving armature and two preloaded springs is considered as a potential approach in Variable Valve Actuation (VVA) systems for internal combustion engines. The analysis of the upper electromagnet has been performed using Finite Element Method (FEM) simulation. Thereby an axially ...

Large Scale Outdoor Flammable & Toxic Gas Dispersion Modelling in Industrial Environments

A. Hallgarth[1], A. Zayer[1], A. Gatward[2], and J. Davies[2]

[1]Hazard Research & Risk Consultants Ltd, Aberystwyth, Wales, United Kingdom
[2]Independent Consultants, United Kingdom

HazRes has developed a gas discharge and dispersion model in COMSOL which takes into account the effects of localized wind profiles and turbulence generated by buildings, structures and terrain on the dispersion of gases in question. The main focus of this work is to develop and provide clients with more accurate prediction methods relative to industrial standard software tools in modeling ...

Modelling Waste Water Flow in Hollow Fibre Filters

I. Borsi[1] and A. Fasano[1]
[1]Dipartimento di Matematica U. Dini, Università di Firenze, Firenze, Italy

In this paper we present a model to describe the process of waste water filtration based on hollow-fibre membrane filters. In particular, we deal with membranes whose pores diameter is in the range 0.01-0.1 µm. The main problem in these filtering systems is the membrane fouling. The mathematical model consists in two equations for the Darcy's flow through the filter, coupled with an ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

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