Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Non-Equilibrium Quantum Well Populations and Optical Characteristics of III-Nitride Lasers and Light-Emitting Diodes

M. Kisin, and H. El-Ghoroury
Ostendo Technologies, Inc.
Carlsbad, CA

COMSOL-based Ostendo’s Optoelectronic Device Modeling Software (ODMS) has been updated to include effects of non-equilibrium QW populations in semiconductor light-emitting and laser diodes. III-nitride light emitters with different levels of polarity have been compared as an illustrative example of ODMS performance. Modeling proved that high intra-QW recombination rates in III-nitride light ...

Effect of Gas Flow Rate and Gas Composition in Ar/CH4 Inductively Coupled Plasmas

L. Tong
Keisoku Engineering System Co. Ltd.

The discharge properties in low pressure inductively coupled Ar/CH4 plasmas operating at an RF frequency of 13.56 MHz and total gas pressure of 20 mTorr are studied in this work. The calculation of gas flow is performed in coupling with the plasma simulation. The gas flow rate is varied from 20 to 1000 sccm. The species taken into account include electrons, six kinds of molecules, eleven kinds ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Modeling the Performance of Energy Recovery Ventilators

N. Lemcoff[1], R. Pastor[2], and E. Miravete[1]
[1]Rensselaer Polytechnic Institute, Hartford, CT
[2]General Dynamics Electric Boat, Groton, CT

The objective of this study is to numerically evaluate the effectiveness of an energy recovery ventilator (ERV) during the summer and winter seasons. The energy recovery ventilator allows heat and mass transfer between two air streams separated by a membrane. The effects of varying the following parameters were examined: flows through the supply and exhaust ducts, height of the exhaust channel, ...

Modeling System Dynamics in a MEMS-Based Stirling Cooler

D. Guo, A. McGaughey, G. Fedder, M. Lee, and S. Yao
Carnegie Mellon University
Pittsburgh, PA

Micro-scale devices based on the Stirling cycle are an attractive choice for chip- and board-level electronics. A new Stirling cycle micro-refrigeration system composed of arrays of silicon MEMS cooling elements has been designed. COMSOL is used to evaluate the thermal performance of the system. Simulation of compressible flow and heat transfer with a large deformed mesh has been successfully ...

The Transient Modeling of Single-Bubble Nucleate Boiling in a Sub-Cooled Liquid Using an ALE Moving Mesh

C. J. Forster, and M. K. Smith
Georgia Institute of Technology
Athens, GA

This paper investigates the evolution of a single bubble going through growth, pinch-off, and condensation while rising due to buoyancy forces in a sub-cooled liquid. Phase change is modeled on the evolving liquid-vapor interface by considering changes in enthalpy and heat fluxes at the interface. A comparison of the ALE model is made with the same single-bubble system computed with a level-set ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Study on the Holding Characterestics of a Magnetic Gripper

R. Wadhwa[1], G. Monkman[2], and T. Lien[1]
[1]NTNU Valgrinda, Inst. for produksjons- og kvalitetstek., Trondheim, Norway
[2]FH Regensburg, Regensburg, Germany

Magnetic grippers are commonly used for workholding in handling and assembly of ferrous metalcasted parts. The workholding force produced by the magnetic gripper is strongly influenced by the texture and form of the workpiece in contact with its surface. This work explores the optimal design of an electromagnet to handle parts of varying profile radii by increasing the magnetic field gradient ...

Transient Pseudo-3D Model of Multi-Beam Laser Thermal Treatment System

J. Brcka
Technology Development Center
TEL US Holdings, Inc.
Albany, NY

Laser thermal treatment (LTT) systems have applications in IC fabrication for improving low-k dielectrics properties, polymer curing and resist processing. This contribution deals with a transient model of fast scanning and pulsing laser multi-beam system used in semiconductor processing. General Heat Transfer application mode formulation with multi-scale modelling approaches are employed. The ...

Analysis of Thermoelectric Phenomena

J. Crompton, S. Yushanov, L. Gritter, and K. Koppenhoefer
AltaSim Technologies, LLC.
Columbus, OH

Thermoelectric phenomena provide the direct conversion of heat into electricity or electricity into heat, the phenomena is described by three related mechanisms: the Seebeck, Peltier and Thomson effects. Thermoelectric devices have found many applications ranging from temperature measurement, solid state heating or cooling and direct energy conversion from waste heat. In this paper, analysis ...

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