Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulation of Unidirectional Interdigital Transducers in SAW Devices using COMSOL Multiphysics

D. Pradeep, N. Krishnan, and H. Nemade
Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, India

Surface acoustic wave (SAW) devices based on Rayleigh wave, shear wave, love wave, acoustic plate mode (APM) wave and flexural plate wave have been explored for sensors, actuators and telecommunication applications. An interdigital transducer (IDT) is a metallic comb-like structure fabricated over piezoelectric substrate. SAWs are generated over the substrate by applying electrical signal to the ...

Numerical and Experimental Evaluation for Measurement of a Single Red Blood Cell Deformability Using a Microchannel and Electric Sensors

K. Tatsumi[1]
[1]Kyoto University, Kyoto City, Kyoto, Japan

An electric micro-resistance sensor that can continuously measure the deformability of a single red blood cell (RBC) in a microchannel and a numerical model that can simulate the resistance and capacitance of the cell membrane and cytoplasm are developed and improved. The resistance signal pattern between the electrodes is measured to evaluate the feasibility of the present sensor, using the ...

Design and Modeling of a Micro-active Suspension

T. Verdot, and M. Collet
Dept. of Applied Mechanics, FEMTO-ST Institute, Besançon, France

Nowadays, lightweight materials are widely used to reduce weight and increase available space in moving structures such as cars or aircraft. However, they constitute an intense vibrating environment that can strongly affect the operation of embedded micro-transducers such as frequency generators or inertial sensors. To alleviate this problem, we propose the concept of a Micro-Active Suspension ...

A Methodology For The Simulation Of MEMS Spiral Inductances Used As Magnetic Sensors

S. Druart, D. Flandre, and L.A. Francis
Université catholique de Louvain - ICTEAM, Louvain-la-Neuve, Belgium

In this paper, a methodology to simulate the electric behavior of spiral inductances is presented and discussed. All the methodology is built with the COMSOL software used with the Matlab scripting interface and then allows performing fully parameterized simulations. The program architecture is explained and is used to simulate two applications. The first calculates the voltage induced by an ...

Simulation of DC Current Sensor

K. Suresh, B.V.M.P.S. Kumar, U.V. Kumar, M. Umapathy, and G. Uma
National Institute of Technology Tiruchirapalli, Tamil Nadu, India

A proximity DC current sensor using of a piezo sensed and actuated cantilever beam with a permanent magnet mounted at its free end is designed and simulated in COMSOL Multiphysics. The change in resonant frequency of cantilever is a measure of the current through the wire. The sensor is found to be linear with good sensitivity.

Magnetic Nanoparticles for Novel Granular Spintronic Devices

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

Superparamagnetic nanoparticles have a wide range of applications in modern electric devices. Recent developments have identi fied them as components for a new type of magnetoresistance sensor. We propose a model for the numeric evaluation of the sensor properties. Based on the solutions of the Landau-Lifshitz-Gilbert equation for a set of homogeneously magnetized spheres arranged in highly ...

Finite Element Sensitivity Analysis

M. Perry
London School of Economics

In this presentation we study a PZT Distributed Mode Actuator. In particular, we cover the modeling strategy, the governing equations, modeling setup, the solution and validation. The presentation also gives a comparison between the usage of different Numerical Methods for solving the Partial Differential Equations for this particular type of ...

3D Stationary and Temporal Electro-Thermal Simulations of Metal Oxide Gas Sensor Based on a High Temperature and Low Power Consumption Micro-Heater Structure

N. Dufour[1], C. Wartelle[2], P. Menini[1]
[1]LAAS-CNRS, Toulouse, France
[2]Renault, Guyancourt, France

The aim of this work was to simulate the electro-thermal behavior of a micro-hotplate used as a gas sensor, in order to compare the obtained results with a real structure. The structure has been designed in 3D and a stationary and a temporal study has been realized.

COMSOL Computational Fluid Dynamics for Microreactors Used in Volatile Organic Compounds Catalytic Elimination

M. Olea[1], S. Odiba[1], S. Hodgson[1], A. Adgar[1]
[1]School of Science and Engineering, Teesside University, Middlesbrough, United Kingdom

Volatile organic compounds (VOCs) are organic chemicals that will evaporate easily into the air at room temperature and contribute majorly to the formation of photochemical ozone. They are emitted as gases from certain solids and liquids in to the atmosphere and affect indoor and outdoor air quality. They includes acetone, benzene, ethylene glycol, formaldehyde, methylene chloride, ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

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