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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Making Cartograms and Using them for Data Acquisition

P. Mercure[1], and R. Haley[2]
[1]The Dow Chemical Company, Midland, MI
[2]ATM Research, Midland, MI

We demonstrate cartogram construction, where a geographical map is distorted to represent some measure, for example population, while trying to keep the shape of regions recognizable. We then apply this cartogram construction technique to optimize thermocouple locations. A heat generation and conduction model is used initialize the cartogram construction algorithm. A uniform distribution of ...

Electromagnetic Field Computations for Saturated Porous Media

S. Cambon[1], I. Bogdanov[1]
[1]CHLOE, Bâtiment UFR Sciences et Techniques, Pau Cedex, France

Non-conventional hydrocarbon resources become more and more challenging object for energy producing companies throughout the world. Being already known and long-explored method, the electromagnetically (EM) assisted recovery constitutes a promising idea of technology for deposits of such a kind. COMSOL has been used recently for modeling the thermal multiphase flow through porous media in the ...

Theoretical Simulations of Silicon-On-Nothing (SON) Structures

C. Grau Turuelo[1], B. Bergmann[1], C. Breitkopf[1], F. Hoffmann[2], L. Brencher[2]
[1]Technische Universität Dresden, Dresden, Saxony, Germany
[2]Infineon Technologies GmbH, Dresden, Dresden, Saxony, Germany

A novel technique for semiconductor manufacturing is introduced: Silicon-On-Nothing. This process consists of an initial cylindrical trench which has a shape evolution under certain conditions: high temperature (1100 °C), low pressure (10 Torr) and a non-oxidizing atmosphere such as hydrogen. These conditions enable a, mainly, surface diffusion phenomenon whose final result is an empty space ...

Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process

T. Soares[1], H. Mozaffari[2], H. Reinecke[1]
[1]Universität Freiburg, Freiburg im Breisgau, BW, Germany
[2]Hochschule Furtwangen, Tuttlingen, BW, Germany

The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase ...

Upscaling of Heterogeneous Rock Properties via a Multiscale Image to Simulation Approach

S. Zhang[1], M. Pal[2], P. Barthelemy[1], M. Lei[1]
[1]Visualization Sciences Group, Burlington, MA, USA
[2]Shell International Exploration and Production, Rijswijk, The Netherlands

The mass and recoverability of oil and gas in unconventional reservoirs strongly depend on the understanding the petrophysical properties of the rocks at a large range of scales. Three-dimensional imaging is capable of unveiling the detailed microstructures within the rocks down to the nanometer scale. Using a multiscale imaging protocol, a Devonian shale rock sample with heterogeneities is ...

Multiphysics Simulations for the Design of Probe-Heads Micro-Needles

A. Corigliano[1], A. Courard[1], G. Cocchetti[1], P. Gagliardi[1], L. Magagnin[1], R. Vallauri[2], D. Acconcia[2]
[1]Politecnico di Milano, Milano, Italy
[2]Technoprobe, Cernusco Lombardone, Italy

The paper presents recent results concerning the experimental mechanical characterization, the numerical modeling and the design of micro-needles used in the construction of probe heads for wafer testing. A fully coupled electro-thermal model was created using COMSOL and combined to a research-oriented thermo-mechanical Finite Element (FE) code in order to accurately reproduce the micro-needle ...

Application of Numerical Simulation in Geotechnical Engineering

Dr. Meen-Wah Gui[1]
[1]Department of Civil Engineering, National Taipei University of Technology, Taipei, Taiwan

In this work, COMSOL Multiphysics was used to develop a model to investigate the degree of saturation in sloped terrain. The model was validated via laboratory experiments incorporating Lan’s man-made rainfall slope model test. The validated model was used in an actual case study to simulate the Maokong Landslide.

Estimation of Volcanic Deformation Source Parameters Through Optimization of Geodetic Data at Cotopaxi Volcano, Ecuador - new

J. Hickey[1], J. Gottsmann[1], P. Mothes[2]
[1]University of Bristol, Bristol, UK
[2]Instituto Geofísico, Escuela Politécnica Nacional, Quito, Ecuador

Volcanic eruptions are often preceded by periods of unrest, where the behavior of the volcano deviates from a background level towards one of increasing concern [1]. Understanding what causes and contributes to unrest is a key challenge in volcanology today, influencing risk mitigation and hazard forecasting. Deformation of the volcanic edifice is one such indicator of unrest owing to a ...

Princípio Calorimétrico Aplicado a Medição de Vazão - new

T. Cavalcanti[1], A. Lima[1], J. Neto[1]
[1]Universidade Federal de Campina Grande, Campina Grande, PB, Brasil

Introdução: A medição adequada de vazão de fluidos é de grande importância nos processos industriais, pois tem implicações diretas na qualidade, produtividade, segurança e eficiência dos processos. Assim, torna-se necessário compreendermos como os fluidos se comportam para baixas velocidades, podendo, dessa forma, projetar estruturas que possam trabalhar em uma faixa de operação ...

Efficient Heat Management Technique for Electronic Display Device

U. Shukla[1], and D. Gupta[1]
[1] Department of Materials and Metallurgical Engineering, Indian Institute of Technology Kanpur, Uttar Pradesh, India

One of the major challenges faced by the semiconductor industry is that electronic circuits produce a lot of heat energy during their operation. And with the current scenario where the gates are packed so much close together, then the problem of heat generation has become extremely significant. So we are working towards the efficient heat management and dissipation solution for the heat generated ...

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