Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

COMSOL Multiphysics® Software and PV: A Unified Platform for Numerical Simulation of Solar Cells and Modules

M. Nardone [1],
[1] Bowling Green State University, Bowling Green, OH, USA

Introduction: Existing solar cell (photovoltaic, PV) device simulation software is either open source with limited capabilities (1D only) [1,2] or extremely expensive with obscure functionality [3]. PV researchers need an accessible and versatile simulation tool to optimize existing technologies and to reduce the time from concept to prototype for new technologies. This work demonstrates how ...

Computation of Velocity, Pressure and Temperature Distributions near a Stagnation Point in Planar Laminar Viscous Incompressible Flow

E. Kaufman[1], and E. Gutierrez-Miravete[2]

[1]Pratt and Whitney, East Hartford, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

As gas turbine temperatures and component life requirements continue to rise, it becomes increasingly important to have a good understanding of the operating temperatures of their components. The objective of this study was to explorate whether a Hiemenz flow approximation based on measured static pressures near an airfoil leading edge can provide a good estimate of the leading edge heat ...

Optical and Electrical Modeling of Three Dimensional Dye Sensitized Solar Cells

P. Guo[1]
[1]Northwestern University, Evanston, IL, USA

Dye sensitized solar cells (DSSCs) have received tremendous attention as alternative photon harvesting devices. While the sintered TiO2 nanoparticle network attached with dye molecules achieves efficient photon absorption, the electrons have to diffuse through the long TiO2 network to reach the contact, resulting in a high electron density and thus increased recombination. Extensive research ...

Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach - new

A. Lecoanet[1], D. G. Ivey[1], H. Henein[1]
[1]Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada

A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the simulation and Rosenthal’s solution, when the geometry of the domain and the source are changed, has been ...

Modeling Microwave Chiral Material Based On Crank Resonators Arrays Using COMSOL Multiphysics

J. Muñoz[1], G.J. Molina [1], M.M. Rojo[1]
[1]Dpto. Electromanetismo y Electrónica, Facultad de Química, Universidad de Murcia, Campus Espinardo, Murcia, Spain

Electromagnetic metamaterials present exotic and unusual properties hardly to be found in nature with many potential applications. They are usually built by distributing small resonant structures in periodical lattices. If the structure has chiral symmetry, the medium is called chiral metamaterial. Here the electrodynamics behavior of a chiral structure with a huge electromagnetic activity at ...

FEM Based Design and Simulation Tool for MRI Birdcage Coils Including Eigenfrequency Analysis

N. Gurler[1], Y. Ziya Ider[1]
[1]Department of Electrical and Electronics Engineering, Bilkent University, Ankara, Turkey

Designing a Radio Frequency (RF) birdcage coil used in Magnetic Resonance Imaging (MRI) at high frequencies where the wavelength is comparable with the coil dimensions is a challenging task. Before construction of the coil, not only calculating the capacitance value which is necessary for the coil to resonate at the desired frequency but also geometrically modeling the coil in a 3D simulation ...

Modelling of Pressure Profiles in a High Pressure Chamber using COMSOL Multiphysics

P. S. Rao[1], C. K. Chandra[1]
[1]Agricultural and Food Engineering Department, Indian Institute of Technology Kharagpur, West Bengal, India

High Pressure Processing (HPP) is a leading non-thermal food processing technology that is often cited as a major technological innovation in food preservation. Although it is very early to place this emerging technology among the list of breakthroughs in food processing, HPP has started to become a viable commercial alternative for pasteurisation of value added fruits, vegetables, meat, and ...

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda[1], S. Birla[2], J. Subbiah[2], H. Thippareddi[1]
[1]Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
[2]Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...

Modeling of Ultrasonic Transducers and Ultrasonic Wave Propagation for Commercial Applications Using Finite Elements with Experimental Visualization of Waves for Validation - new

D. R. Andrews[1]
[1]Cambridge Ultrasonics, Over, UK

Finite element (FE) modelling of ultrasonic propagation using COMSOL Multiphysics® simulations can be used to create images of waves. Unfortunately, in time-stepping solutions, it is possible for numerical instabilities to grow large and dominate the solution adversely. Any design of transducer that is based upon poorly-configured FE models is unlikely to perform as expected and will almost ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...