Simulation of Hygro Swelling Induced Stresses in Flip Chip Interconnects in a Stress-Sensitive Chip-on-Board Configuration
Optics & Packaging, CSEM SA, Central Switzerland Center, Alpnach, Switzerland
Flip chip interconnections are used for the direct electrical connection of face-down electronic components like MEMS pressure sensors. The investigated bonding technologies are gold stud bumping in combination with anisotropic conductive adhesives (ACA) and solder ball bumping in combination with underfill in a chip-on-board configuration. The modeled chip is an absolute pressure sensor based on ...
J. Gaillard, D. Locatelli, S. Mulani, and R. Kapania
Microelectronics and Micromechanics Department, Engineering school of ENSICAEN (Ecole National Superieure d'Ingénieurs de Caen), Caen, France
 Engineering Science and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
 Aerospace and Ocean Engineering Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
The residual stresses developed in a stiffened panel manufactured using Electron Beam Freeform Fabrication (EBF3) process were studied. EBF3 process is a layer additive process that can be used to build near-net shaped parts directly using computer controlled techniques, which can be used for aerospace structures. A COMSOL model was created to simulate the residual stresses using a ...
S. Yang, and S. Seelecke
Department of Aerospace, Northwestern Polytechnical University, Raleigh, NC, USA
Department of Mechanical & Aerospace Engineering, North Carolina State University, Xi’an, Shaanxi, China
The application of shape memory alloys (SMA) as actuators in smart structures is a quickly developing field. The particular focus of this paper is on the aspects of modeling and simulation of adaptive structures with integrated SMAs using the finite element method (FEM). A number of generic SMA actuator wire/elastic beam systems are presented first to illustrate the different ways of ...
Z. Hasan, F. Darwish, and S. Al-Absi
Texas A&M University, College Station, TX, USA
Jordan University of Science and Technology, Irbid, Jordan
The main objective of the present work is to perform stress analysis on composite laminates under unaxial/biaxial loading to serve as a preliminary data for test verification. A detailed calculation based on the Classical Lamination Theory was performed for a laminate. The material used was carbon/epoxy applying a pure uniaxial load followed by a biaxial load. It was observed that the failure ...
Time-Dependent Thermal Stress and Distortion Analysis During Additive Layer Manufacturing, by Powder Consolidation by Laser Heating
M.S. Yeoman, J. Sidhu
1. Continuum Blue Ltd., Tredomen Innovation & Technology Park, Tredomen, Ystrad Mynach, United Kingdom
BAE Systems, Advanced Technology Centre, Bristol, United Kingdom
A time-dependent COMSOL Multiphysics model of an additive manufacture process, which uses powder consolidation by laser heating was developed, providing a platform to better understanding the manufacture process & provide a tool to reduce resulting distortion & optimization of an additive manufacture process. The model simulates a high intense laser energy source moving along a pre-defined time ...
Strauss, D.J., Trenado, C.
Institute of New Materials, Saarbrücken
Mathematical modeling at the Institute of New Materials has played a crucial role in supporting the manufacturing and design of new technologies of nanomaterials, whose applications range from transportation, electronics and optics engineering to environmental sciences. In this paper, we focus our attention to two mathematical models together with their corresponding FEMLAB simulations: The ...
V. Antonucci, M. Esposito, R. Marzella, and M. Giordano
Institute for Composite and Biomedical Materials, CNR, Portici, NA, Italy
Imast, Portici, NA, Italy
A quasi static indentation test on a laminate composite has been investigated numerically and experimentally. In particular, the test has been implemented by COMSOL Multiphysics® and optimizing the Finite Element and mesh. In addition, the numerical strain results have been validated by the comparison with the respective experimental deformation data that have been obtained by fiber Bragg ...
C. Thiagarajan, G. Shenoy, B. S. Shenoy
ATOA Scientific Technologies Pvt Ltd, Whitefield, Bangalore, India.
Department of Mechanical & Manufacturing Engineering, Manipal Institute of technology, Manipal, India
Department of Aeronautical & Automobile Engineering, Manipal Institute of Technology, Manipal, India
Vibration and Dynamic performances of the rotating machinery are conventionally evaluated based on the dominant structural forces such as the centrifugal forces. The increase in rotational speed, miniaturization and performance, demands for improved and accurate evaluation of the vibration performance. The inclusion of coupled effects of fluid and centrifugal forces can contribute significantly ...
Implementation of a Multi-Axial Pseudoelastic Model to Predict the Dynamic Behavior of Shape Memory Alloys
F. Thiebaud, M. Collet, E. Foltête, and C. Lexcellent
Institut FEMTO-ST, Besancon
Shape Memory Alloys are good candidates for being used as passive dampers, strain sensors, stiffness or shape drivers. In order to develop the use of these alloys in structural vibration control, we present in this paper how to implement a phenomenological model based on the Rl model in COMSOL Multiphysics. We use this implementation to simulate internal loops in order to characterize the ...
Indian Institute of Technology, Bombay
The Finite Element Method (FEM) is applied for numerical analysis of a Shape Memory Alloy (SMA) beam fixed at both the ends, using a thermodyanamic constitutive model The wire is heated through resistive heating by providing controlled potential at the ends of the beam. Results show that the beam tends to return to its original position and the curvature of the beam is simulated.