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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modelling Failure Mechanims in Sands Under Extreme Loads Using COMSOL

J. Mwebesa, D. Kalumba, and R. Kulabako
Makerere University
Kampala, Uganda

Studies by Nishaat (2009) showed that Terzaghi\'s bearing capacity model didn\'t adequately predict the bearing capacity failure in Philippi Dune sands. Nishaat carried out her investigation using a physical model that was built in a geotechnical laboratory. The failure surfaces she observed in the sands did not resemble those predicted by Terzaghi and Meyerhof\'s models. However the use of a ...

Simulation of a Seal

V. Viola[1]
[1]CARCO, Basiano, Milano, Italy

Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...

Optimization of Smart Diaphragm Material for Pressure Sensor in Ventilators

M. Algappan[1], P. C. Chakravarthi[1], R. Keerthana[1], S. Mangayarkarasi[1], A. Kandaswamy[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

A medical ventilator is an imperative device used to save life by delivering an assortment of air and oxygen into and out of the patients’ lungs to administer breathing or to assist obligatory breathing. The commercially available diaphragm based pressure sensors made up of silicon measure the air and oxygen flow. The proposed work utilizes the Piezo electric material for the pressure range ...

Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM

G. Petrone, and G. Cammarata
University of Catania, Catania, Italy

 It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM ...

Electro-Thermo-Mechanical Finite Element Modeling to Investigate the Reliability of Automotive MOSFET Transistor

T. Azoui, P. Tounsi, and J.M. Dorkel
CNRS, LAAS, Toulouse, France

3D electro-thermo-mechanical finite element model of power vertical MOSFET used in the automotive industry is presented in this paper. The presented paper is a qualitative study of power device results from electro-thermo-mechanical simulation. This study particularly interested in the stress generated at the interface between the bonding wires and the source metallization to evaluate the ...

Multifunctional Fluid Power Components using Engineered Lattice Structures

S. Newbauer, D. Cook, and D. Pettis
Milwaukee School of Engineering
Milwaukee, WI

Designing a component with multiple functions, e.g. load bearing and noise attenuation, can increase the effectiveness of each component and reduce the complexity of the overall system, thereby improving system efficiency as well. Current multifunctional components include metal foam. It is posited that the cellular pores of the metal foam can be engineered and optimized for desired ...

Multiphase Transport with Large Deformations Undergoing Rubbery-Glassy Phase Transition: Applications to Drying

T. Gulati[1], A. Datta[1]
[1]Department of Biological and Environmental Engineering, Cornell University, Ithaca, NY, USA

Drying of biomaterials such as foodstuffs involves mass, momentum and energy transport along with large shrinkage of the porous material, which have significant effects on their final quality. Foodstuffs exhibit non-linearity when undergoing large deformations that affect the transport process in a critical way. Thus, it becomes important to perform a two-way coupling of the multiphase transport ...

Fluid Structure Interaction Applied to Upper Aorta Blood Flow

J. Anza[1], and M. Esteves[2]
[1]Department of applied mathematics, University of the Basque Country, Bilbao, Spain
[2]University of the Basque Country, Bilbao, Spain

This work deals with the computer simulation of the blood flow, the arterial wall deformation and their 3D bidirectional interaction, including initial stresses and root displacements. The flow is laminar and steady with flexible walls modeled with a hyperelastic Demiray material model. Poiseuille formula is used to check the bidirectional interaction. 2D axisymmetric and full 3D models have ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

Fracture on Circuit Board Internal Layers Due to Thermal Stress on Soldered Pins

F. Figueroa[1], P. Aguirre[1]
[1]Sensor Technik Wiedemann GmbH, Kaufbeuren, Germany

Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D thermo-mechanical model of a soldered pin is achieved in two simulation steps. First, a connecting pin already ...