Using the ECAD Import Module, you can bring your ECAD files into COMSOL Multiphysics where the 2D layouts are automatically converted to 3D CAD models. This opens up the world of modeling for simulating, among other applications, the components in integrated circuits, systems of connected MEMS devices, and electronics cooling.

The ECAD Import Module supports the popular ODB++(X), GDS-II, and NETEX-G file formats. As part of the import process, you can select which subset of cells, nets and layers to import. You can also edit layer thicknesses, control the geometric representation of bond wires, and include selected dielectric regions prior to or after importing.

The layout is automatically extruded and converted to a 3D CAD model for use in any kind of COMSOL Multiphysics simulations with any combination of add-on products. The 3D geometry model can further take part in general solid modeling operations in COMSOL Multiphysics. When combined with the Parasolid® kernel, using the CAD Import Module or one the LiveLink™ products, the 3D model can be exported to the Parasolid file formats .x_b or .x_t, for use in other software.