Researching with the MEMS Module
The MEMS Module contains modeling interfaces for electromechanical couplings, thermo-mechanical couplings, fluid-structural interactions, and microfluidics applications. Consider:
A pressure sensor gives the pressure through returning capacitance change - capacitance is related to the deformation of the structure. Deformation depends on the ambient pressure and temperature, on the materials used, and on any initial stresses in the material.
- Unlimited multiphysics couplings—Built into the module are a number of predefined multiphysics couplings found in most microelectromechanical systems. Furthermore, you can couple models from the MEMS module with other physics such as acoustics, chemical reactions, radiation, and electromagnetic wave phenomena
- Full structural analysis—This module computes static and dynamic responses as well as performs modal and damped analyses, frequency-response analyses, plus loss-factor and equivalent viscous damping. It does so for linear elastic, elastoplastic, hyperelastic, large deformation, and piezoelectric responses
- Microfluidics modeling—Modeling interfaces allow you to study general laminar, incompressible Navier-Stokes, non-isothermal, Stokes, two-phase, capillary and electrokinetic flow. In collaboration with the Chemical Engineering and Earth Science modules, this software allows for unparalleled examination of turbulent and porous media flow
- Material Library—A large material library of structural mechanics, electromagnetic, and fluid properties is available within the MEMS Module
