Electrodeposition on a Resistive Patterned Wafer
Model ID: 12361
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.
|Electrolyte currents and potential in the cup-plater reactor.|