Electrodeposition on a Resistive Patterned Wafer
Model ID: 12361
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.
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Electrolyte currents and potential in the cup-plater reactor. |
