This is the transient model of a single phase E-core transformer using a Multi-Turn Coil Domain. The model includes the effect of a nonlinear B-H curve in the core and shows how to connect the transformer model to the external circuits...
A plane wave is incident on a wire grating on a dielectric substrate. Coefficients for refraction, specular reflection, and first order diffraction are all computed as functions of the angle of incidence. The model is set up for one...
This model is intended as a first introduction to simulations of fluid flow and conjugate heat transfer. It shows you how to: Draw an air box around a device in order to model convective cooling in this box. Set a total heat flux on a...
In this tutorial model, couple heat and mass transport equations to laminar flow in order to model exothermic reactions in parallel plate reactor. It exemplifies how COMSOL Multiphysics allows you to systematically set up and solve...
A silicon wafer is heated up by a laser that moves radially in and out over time. In addition, the wafer itself is rotated on its stage. The incident heat flux from the laser is modeled as a spatially distributed heat source on the...
This model demonstrates how to set up a fluid-structure interaction problem in COMSOL Multiphysics. It illustrates how fluid flow can deform solid structures and how to solve for the flow in a continuously deforming geometry. The...
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics,...
This model treats the flow field and species distribution in an experimental reactor for studies of heterogeneous catalysis. The model exemplifies the coupling of free and porous media flow in fixed bed reactors. The reactor consists...
This example models the casting process of a metal rod from melted to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat...
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection,...
