J. Brcka - TEL Technology Center, Albany, NY
In the past, the design of chip manufacturing and processing equipment depended mostly on empirical methods due mostly to the incomplete understanding of the fundamental physical and chemical phenomena.
Yet, without adequate understanding of the processes through modeling, finding equipment that does the job as required under complex chemistry environments, heat and electromagnetic field loads, is primarily trial and error. Not only do non-workable components turn into expensive scrap, but it can also take weeks to get such prototype components to be made.
Dr. J. Brcka, of the Tokyo Electron Ltd Technology Center has succeeded in building models that simulate the semiconductor wafer manufacturing process far more accurately. With good models, it´s now possible to test 10 or 20 cases in just days and thus get a new process online as quickly as possible.