F Cacho and V. Fiori, STMicroelectronics
Semiconductor engineers have developed accelerated life-cycle tests, which place components under high current stress and temperature. Based on such experiments we have also started to develop models that predict semiconductor lifetimes.
We are currently using COMSOL Multiphysics to develop better predictive failure models so that we can save time in our qualification process and also be sure that we are indeed using worst-case scenarios. With the help of these models we also get insight into process design rules that define, for instance, the minimum size for interconnects.