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Mechanical Blog Posts

How to Model Different Types of Damping in COMSOL Multiphysics®

March 15, 2019

Structural dynamics analyses can be difficult if you have to account for damping. Get a demonstration of how to use the different numerical models for damping in COMSOL Multiphysics. Part 2 of 2.

Damping in Structural Dynamics: Theory and Sources

March 14, 2019

Here’s your introduction to the theory behind damping in vibrating structures, as well as its sources, including internal losses, friction, sound emission, and more. Part 1 of 2.

Veryst Combines Material Testing and Simulation for Reliable Results

March 11, 2019

Simulation helps companies develop the best designs. Understanding material behavior plays a key role in generating accurate simulations. Here’s how Veryst combines testing and FSI simulation.

Performing a Multiphysics Analysis of a Thermal Microactuator

March 8, 2019

To design an optimized thermal microactuator for use in a specific device, you need to account for tightly coupled electrical, thermal, and structural phenomena in your analysis.

Hydrodynamic Thermal Transport in the Kinetic-Collective Model

February 28, 2019

F. Xavier Alvarez from the Universitat Autònoma de Barcelona (UAB) discusses using COMSOL Multiphysics® to model heat transfer at the nanoscale and better understand transport processes.

Designing Heating Circuits with Multiphysics Simulation

February 12, 2019

The electronic message boards you see on the highway contain heating circuits. Their design is a truly multiphysics problem involving heat transfer, structural mechanics, and electromagnetics.

Analyzing an Arterial Self-Expanding Stent with COMSOL Multiphysics®

February 6, 2019

Interested in bioengineering? Read this overview of a self-expanding arterial stent modeled in COMSOL Multiphysics® with an implemented shape memory alloy material.

Paper Mechanics and the Benefits of Modeling Paperboard Formation

January 31, 2019

Get a quick introduction to paper mechanics before guest blogger Eric Linvill discusses modeling a L&W bending resistance test piece for cost-benefit analyses in paperboard production.