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Heat Transfer & Phase Change Blog Posts

Modeling Thermal Ablation for Material Removal

March 30, 2016

Whenever solid materials are heated enough, they will melt and then vaporize to a gas. Certain materials will even go directly from the solid to the gas phase, a process referred to as sublimation or ablation. If the material is heated strongly enough, there will be significant material removal. Today, we will look at how you can model this process in COMSOL Multiphysics.

Studying Transient Heat Transfer in a Fin Design with an App

February 29, 2016

Continuing his discussion of simulation apps, guest blogger Mehrzad Tabatabaian presents an app that he designed to study transient heat transfer in a nonprismatic fin. In earlier blog post, I spoke about my new book, COMSOL5 for Engineers, a resource designed to inspire and guide the creation of COMSOL models and simulation apps. Today, I’ll share a model with you that I created to analyze transient heat transfer in a fin as well as its corresponding app.

Design Safe Wearable Technology with Heat Transfer Modeling

February 1, 2016

Year by year, wearable technology grows in popularity for both consumer and medical applications. These devices are meant for continued use, but the heat that they produce could lead to malfunction and burns if not properly designed. To prevent injury to the device user, it’s important to take the effects of heat transfer into account during the design process. The simulation capabilities of COMSOL Multiphysics make this possible.

Analyze the Spread of Epidemic Diseases with Simulation

January 25, 2016

Surely you remember the last time you were stuck in bed with the flu. Influenza, commonly known as the flu, can be at the very least an unpleasant experience, but it also claims a lot of casualties every year. Today, public health officials use mathematical modeling techniques to study the flu and other infectious diseases to predict their spread and make informed decisions about public health.

Designing Apps to Thermally Characterize Electronic Devices

January 18, 2016

Today, guest blogger and Certified Consultant Giuseppe Petrone of BE CAE & Test discusses creating apps to perform thermal analyses of electronic devices. When manufacturing electronic devices, leading companies often look to simulation in order to thermally characterize their products. At BE CAE & Test, we have found a more efficient way of answering such requests: designing apps that are tailored to our customers’ needs. Our surface-mount device app, presented here, is just one testament to what apps can achieve.

Analyze Thin Structures Using Up and Down Operators

January 12, 2016

Modeling complex geometries with thin structures can be very costly in terms of computational effort, particularly as such structures require quite a lot of mesh elements in order to resolve them. COMSOL Multiphysics provides dedicated features for modeling thin structures so that such models can be solved efficiently while maintaining accuracy. To set up and postprocess thin structures, COMSOL Multiphysics also provides specialized operators to help you consider all the relevant parameters required for accurate results.

Analyze Solar Food Dryer Designs with Heat Transfer Modeling

January 6, 2016

Contaminated produce contributes to food waste — a growing problem in the global agricultural industry. Solar dryers are one way to preserve fruits and vegetables, but these devices must be able to function properly to be effective. Heat transfer simulation can be used to analyze solar food dryer designs and identify the right building materials, including phase-change materials (PCMs), which conserve the solar heat. Today, we’ll explore simulation research focused on optimizing a solar dryer design for efficient food preservation.

Analyzing a Novel Pin Fin Microchannel Design with Simulation

December 7, 2015

Microchannels are versatile structures that can be used for thermal management. One way to optimize heat transfer within such systems is by adding a pin fin heat sink to the microchannel configuration. Applying this approach, a team of researchers created a novel pin fin design, analyzing its heat transfer efficiency with COMSOL Multiphysics. They presented their innovative work at the COMSOL Conference 2015 Boston.


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