May 31, 2018 Burlington, Massachusetts9:00 AM - 5:00 PM

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You are invited to join us at COMSOL Day Boston for a day of minicourses, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.

View the schedule for minicourse topics and presentation details. Register for free today.


8:30 a.m.
8:55 a.m.
Welcoming Remarks
9:00 a.m.
Invited Speaker and Parallel Minicourse
Introduction to COMSOL Multiphysics® and the Model Builder

This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will cover all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and postprocessing.

Matthew Hancock, Veryst Engineering

Modeling and Simulation of Microfluidic Devices

Modeling and simulation are key components of the engineering development process, providing a rational, systematic method to engineer and optimize products and dramatically accelerate the development cycle over a pure intuition-driven, empirical testing approach. Modeling and simulation help to identify key parameters related to product performance (“what to try”) as well as insignificant parameters or conditions related to poor outcomes (“what not to try”). For microfluidic devices, modeling and simulation can inform the design and integration of common components such as micropumps, manifolds, and channel networks. Modeling and simulation may also be used to estimate a range of processes occurring within the fluid bulk and near cells, including shear stresses, transport of nutrients and waste, chemical reactions, heat transfer, and surface tension and wetting effects. I will discuss how an array of modeling tools such as scaling arguments, analytical formulas, and finite element simulations may be leveraged to address these microfluidic device development issues. I will also work through a few examples in detail, including modeling a microfluidic organ-on-a-chip device.

Low-Frequency Electromagnetics Minicourse

Explore the capabilities of COMSOL Multiphysics® for electromagnetics in the static and low-frequency regime with a focus on the AC/DC Module.

10:10 a.m.
Coffee Break
10:30 a.m.
Invited Speakers and Parallel Minicourse
Jeffrey Doody, MIT

Using Multiphysics Simulation in the Study and Design of Tokamaks

Fusion is the power source of the universe and the team at the Plasma Science Fusion Center (PSFC) at MIT is working to make clean, safe, and economical energy from fusion a reality. Research at the PSFC is focused on tokamaks, which use strong magnetic fields to confine a very hot plasma and create the conditions necessary for fusion to take place. The strong magnetic fields and high temperatures seen in a tokamak create a very harsh environment for the experimental devices and structures that are placed inside. Simulations in the COMSOL® software allow us to model the magnetic fields, electromagnetic loads, heat transfer, and fluid flow of coolants in these devices, which is essential to ensure the success of a tokamak fusion reactor.

Nagi Elabbasi, Veryst Engineering

Multiphysics Simulation in Medical Devices and Bioengineering

Computational modeling and simulation helps medical device designers meet demanding performance requirements and shorten development cycles. I will discuss modeling issues specific to medical devices, including the modeling of biological materials, blood flow, electromagnetic tissue heating, and tissue damage. I will also discuss challenges related to multiphysics coupling and to the accuracy of medical device simulations. I will show several medical device simulations we developed at Veryst Engineering using the COMSOL Multiphysics® software, including RF tissue ablation (coupled thermal, electric, and flow physics), heart valves (fluid-structure interaction), and transdermal drug delivery (nonlinear species transport).

Acoustics Minicourse

Get a brief overview of using the Acoustics Module within the COMSOL® software environment.

11:30 a.m.
Coffee Break
11:40 a.m.
Invited Speakers and Parallel Minicourse
Kedar Chitale, FloDesign Sonics

Computational Analysis of Macroscale Ultrasonic Separators

Macroscale ultrasonic separation is a new particle separation technology with various applications, such as cell clarification, cell therapy, blood-lipid separation, oil-water separation, etc. These systems use piezoelectric transducers to create standing waves in fluid-particle mixtures. Suspended particles experience acoustic radiation forces, which depend on the particles' size and acoustic contrast. The particles are separated from a fluid as they cluster, by enhanced gravity or buoyancy. Different sized particles are separated from each other as they experience different magnitudes of the acoustic radiation forces. The fluid dynamics associated with such systems is often more complicated than their microscale counterparts due to strong multiphase effects with interactions between particles, fluid, and acoustics. Computational analysis of such systems consists of two main components: fluid-particle mixture simulations to optimize the fluid path and piezoelectric simulation coupled with structural mechanics and acoustics for the selection of optimal operation frequencies and prediction of acoustic radiation forces. This talk presents computational modeling results of various aspects of the macroscale ultrasonic separators obtained using the COMSOL Multiphysics® software and highlights important insights gained into the working of such systems.

Peter Lyu, Rescale

Cloud HPC Demystified: Best Practices for Executing and Managing Multiphysics Simulations and Apps in the Cloud

Advancement in multiphysics simulation and apps allows engineers to solve more complex engineering problems. Distributing the simulation work across multiple computing nodes provides both a means to solve extremely large problems and to solve multiple model configurations simultaneously. High-performance computing in the cloud offers a variety of advantages for simulation engineers, notably an instantly scalable computing resource, an integrated environment with the COMSOL Multiphysics® software and COMSOL Server™ product, and fully automated deployment tools. Imagine the engineering challenges you could solve with unlimited computing resources. This talk will discuss how simulation engineers overcome the constraints of traditional engineering resources and processes by deploying multiphysics simulations and apps in the cloud.

High-Frequency Electromagnetics Minicourse

Learn about modeling high-frequency electromagnetic waves using the RF Module, Wave Optics Module, and Ray Optics Module.

12:30 p.m.
Break for Lunch
1:30 p.m.
Parallel Session
Introduction to the Application Builder and COMSOL Server™

Learn how to convert a model into a custom app using the Application Builder, which is included in the COMSOL Multiphysics® software. You can upload your apps to a COMSOL Server™ installation to access and run the apps from anywhere within your organization.

CFD and Heat Transfer Minicourse

Get a quick overview of using the CFD Module and Heat Transfer Module within the COMSOL® software environment.

2:15 p.m.
Coffee Break
2:30 p.m.
Parallel Session

Learn about the meshing tools provided in the COMSOL Multiphysics® software. We will introduce you to basic meshing concepts, such as how to plot the mesh or tweak the meshing parameters, as well as advanced topics such as swept and mapped meshes.

Structural Mechanics Minicourse

Get a brief overview of using the Structural Mechanics Module and its add-on modules within the COMSOL® software environment.

3:15 p.m.
Coffee Break
3:30 p.m.
Parallel Session
Solvers Minicourse

Learn the fundamental numerical techniques and underlying algorithms related to linear and nonlinear multiphysics simulations. We will cover the difference between iterative and direct solvers as well as the different study types including stationary, transient, and eigenfrequency analysis.


COMSOL Day Details


100 District Avenue
Burlington, Massachusetts 01803

Parking is available outside Building 100 and there is a parking garage across the street behind Building 2400. Lunch will be provided.

COMSOL Speakers

Walter Frei
Walter Frei leads the applications team in COMSOL's Burlington office. He received his PhD in mechanical engineering from the University of Illinois at Urbana-Champaign, working on the optimization of photonic crystal microcavity lasers. He has been with COMSOL since 2008.
Harishanker Gajendran
Harishanker Gajendran joined COMSOL as an applications engineer specializing in structural mechanics. He has previous experience working as an applications engineer and holds a PhD from the University of Illinois at Urbana-Champaign. His areas of interest are in computational mechanics, inelasticity, and multiphysics problems.
Jinlan Huang
Jinlan Huang is an applications engineer for vibrations and acoustics and instructs acoustics and heat transfer training courses. She received her PhD from Boston University, Department of Aerospace and Mechanical Engineering, investigating acoustic wave propagation in complex-tissue environments and ultrasound-induced tissue heating and bleeding control. She joined COMSOL in 2011.
Mia Johansson
Mia Johansson is a technical sales manager. Before joining COMSOL in 2003, she worked in automotive design engineering and software development at GIS and Image Processing. She has MS degrees in civil engineering and engineering geology from KTH, Stockholm, focusing on fluid flow and contaminant transport in fractured rock materials.
Temesgen Kindo
Temesgen Kindo works at COMSOL as an applications engineer, specializing in structural mechanics and equation-based modeling. Before joining the Burlington, MA office, Temesgen received his PhD in civil engineering from Duke University. He is interested in nonlinear mechanics, multiphysics problems, and applied mathematics.
Chandan Kumar
Chandan Kumar is an applications engineer specializing in structural mechanics and the analysis and design of microelectromechanical systems. He joined COMSOL in 2009. He earned his PhD from Penn State University, where he studied the dynamics of the self-assembly of semiconductor quantum dots. He is a senior member of IEEE.
Akhilesh Sasankan
Akhilesh Sasankan is a technical sales engineer at COMSOL. Before starting at COMSOL, he received master's in mechanical engineering from Arizona State University. Akhilesh's areas of interests include CFD and high-performance computing.
Bjorn Sjodin
Bjorn Sjodin is the VP of product management at COMSOL. He has been with COMSOL since 1995 and started out as a member of the development team in Stockholm, Sweden. He joined the COMSOL office in Burlington in 2002.
Angela Straccia
Angela Straccia is an applications engineer specializing in thermal and fluids engineering. She studied mechanical engineering at Brown University, where she received her BS degree.
Kiran Uppalapati
Kiran Uppalapati is an applications engineer at COMSOL. He received his PhD in electrical engineering from the University of North Carolina, Charlotte. His field of interest is low-frequency electromagnetics and electrical machine design.
Jacob Yström
Jacob Yström is the technology manager of numerical analysis at COMSOL. He has been the lead developer for the solver technology at COMSOL since 2005. He received his PhD in numerical analysis from the Royal Institute of Technology, Stockholm.

Invited Speakers

Kedar Chitale
FloDesign Sonics
Dr. Kedar Chitale completed his master's in mechanical engineering from Rensselaer Polytechnic Institute (RPI) and his PhD in aerospace engineering from the University of Colorado Boulder. He has extensive experience in the CFD modeling and simulation of turbulent and low-Reynolds-number flows. He is a principal R&D engineer at FloDesign Sonics, where he uses the COMSOL Multiphysics® software to characterize and optimize acoustic standing wave chambers and maximize acoustic radiation forces on particles. He is currently building ultrasonic devices for cell therapy applications to concentrate, wash, and fractionate different types of cells.
Jeffrey Doody
Jeffrey Doody is a mechanical engineer at the Plasma Science Fusion Center (PSFC) at MIT. The PSFC‘s research is focused on the development of nuclear fusion as an energy source using tokamaks, devices that confine a superheated plasma with strong magnetic fields. He has created models to simulate structural mechanics, electromagnetic loading, fluid flow, and heat transfer for new designs of devices and experiments to further this goal. Prior to joining PSFC, he worked at Pratt & Whitney in the Compressor Heat Transfer group and earned his master’s degree from the University of Delaware, where he modeled a manufacturing process for thin-film photovoltaics.
Nagi Elabbasi
Veryst Engineering, LLC.
Dr. Nagi Elabbasi is a principal engineer at Veryst Engineering, LLC, and his main area of expertise is modeling multiphysics systems. Dr. Elabbasi has extensive experience in simulating structural mechanics, CFD, heat transfer, acoustics, and coupled systems, including FSI, conjugate heat transfer, and structural-acoustic coupling. Prior to joining Veryst, he worked for nine years in finite element software development. He holds a PhD in mechanical engineering from the University of Toronto.
Matthew Hancock
Veryst Engineering, LLC.
Matthew Hancock earned his PhD in environmental fluid mechanics from MIT. He has since worked in academic, medical, and industrial settings as project lead and a model-based engineering consultant. He is a managing engineer at Veryst Engineering, LLC, and consults in fluid mechanics related to product design and performance, with core areas such as microfluidics, surface tension and wetting, heat transfer, species transport, and mixing. He has worked with the Broad Institute of MIT and Harvard, designing microfluidic devices for genomics and diagnostics applications; Wyss Institute of Harvard University, modeling fluid flow and heat transfer in bioinspired cooling systems; Pennsylvania State University, modeling the wetting and fluid flow near textured surfaces; Brigham and Women’s Hospital and Harvard Medical School, designing microfluidic devices for tissue engineering; and Department of Applied Mathematics at MIT as an instructor. Dr. Hancock has coauthored dozens of peer-reviewed research articles in journals such as Nature Materials, Lab on a Chip, Small, and Biomaterial.
Peter Lyu
Peter Lyu is a solutions architect at Rescale. He manages technical customer engagements for the East and Midwest in the United States. He helps engineers and scientists accelerate their simulations by leveraging the largest and most secure global HPC network on Rescale. Peter received his master's and PhD degrees in aerospace engineering from the University of Michigan, where he worked on several NASA and Boeing projects on aircraft design and the multidisciplinary design optimization of a blended-wing-body aircraft. Prior to joining Rescale, he led the CFD applications team at COMSOL, specializing in fluid flow, heat transfer, and chemical reaction simulations and optimization.

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