March 25, 2021 9:45 a.m.–4:15 p.m. CET

View All COMSOL Day Locations

COMSOL Day: MEMS

See what is possible with multiphysics simulation

Join fellow engineers and simulation specialists to learn about multiphysics simulations in applications that involve microsystem devices. Topics will cover modeling MEMS-based sensors and actuators, as well as optic, microacoustic, and piezoelectric devices.

We welcome both experienced COMSOL Multiphysics® users and those who are new to the COMSOL® software to attend COMSOL Day. The sessions will focus on modeling techniques in the respective application areas, and you will learn about the software features and best practices from applications engineers. Keynote speakers from industries based on or reliant on such devices will provide perspective on the importance of simulation to these applications.

View our schedule below and register for free today!

Schedule

9:45 a.m.
Registration
10:00 a.m.
Welcoming Remarks
10:15 a.m.

Modeling real-world MEMS devices and processes is only possible if multiphysics interactions are included. At small length scales, the design of resonators, gyroscopes, accelerometers, microspeakers, microphones, and actuators must consider the effects of multiple physical phenomena in their operation. These include, for example, electromagnetic-structure, thermostructure, and fluid-structure interactions, as well as damping effects. Numerous simulation users from the MEMS industry therefore use multiphysics simulation as a key element in their product development process.

During this session, the latest trend in modeling the behavior of MEMS components and applications will be investigated: You will learn how simulation specialists make their complex and high-fidelity multiphysics models available for other departments and for their customers.

11:00 a.m.
Invited Speaker
11:30 a.m.
Parallel Sessions
Modeling Piezoelectric Devices

Modeling piezoelectric devices requires a multiphysics approach, where incorporating such models within the design process requires a better understanding of the interactions between structural materials, piezoelectric ceramics, and fluid damping. A more accurate solution for all involved physics reduces development time and prototyping costs. Join this session to gain insight into the most important simulation techniques when it comes to modeling piezoelectric devices.

Tech Café: Meshing Microstructures

Meshing microscopic geometries for the purpose of simulation can be challenging for several reasons. For example, widely different mesh sizes may be advantageous or even required from modeling domain to modeling domain. Alternatively, large directional dependencies on mesh accuracy, due to dimensional requirements or anisotropic behavior of the material parameters, need to be accounted for. Join this Tech Café to discuss the challenges of meshing MEMS and other microsystem devices with colleagues, while receiving useful tips from COMSOL technical staff.

12:15 p.m.
Break for Lunch
1:15 p.m.
Parallel Sessions
Microacoustics

Acoustic propagation in structures with submillimeter physical features is common in the components of consumer products like mobile devices, protective grills of loudspeakers, hearing aids, and perforates used in mufflers and sound insulation. To model this accurately, you need to include thermoviscous losses in your definition of the physics. In this session, you will be introduced to modeling techniques used to capture these effects and how to model nonlinear effects in microacoustics systems.

Tech Café: Material Properties & Orientation

MEMS devices are designed and built in many configurations for a wide range of applications.

One fundamental aspect in the design of such devices is the use and manipulation of different materials. While smart materials such as piezoelectric, piezoresistive, shape memory alloy, and other materials are commonly used, some MEMS devices also incorporate engineered materials such as metamaterials, which exhibit unique electromagnetic or acoustic behavior.

Learn more about the implementation of various special material properties and discuss best practices with interested colleagues in this tech café.

2:00 p.m.
Invited Speaker
2:30 p.m.
Parallel Sessions
MEMS-Based Sensors, Actuators, and Filters

COMSOL Multiphysics® and the add-on MEMS Module contain all of the modeling components and features necessary for analyzing the combined mechanical and electrical behavior in devices on the microscale. This session will introduce the MEMS Module by summarizing its features and demonstrating examples that analyze MEMS-based sensors, actuators, and filters.

Tech Café: Damping Effects

Viscous and thermal damping effects play a significant role in electrical, mechanical, and acoustic behavior at the dimension level of microsystems. This is inherently the case for MEMS devices. In this Tech Café, we will discuss the various damping processes when modeling such systems with colleagues and COMSOL engineers.

3:15 p.m.
Parallel Sessions
Accelerometers, Gyroscopes, and Circuits

MEMS devices for measuring acceleration or orientation in space usually rely on the interaction between electrical and mechanical phenomena. As a consequence, a multiphysics approach often proves necessary to accurately model them. This session will demonstrate how COMSOL Multiphysics® allows you to easily set up such electromechanical models using built-in features in the software.

Tech Café: Efficient MEMS Modeling Methods

It is important for all simulation and design engineers to get an accurate solution as fast as possible for computationally intensive models. This is particularly challenging when it comes to multiphysics models of MEMS devices. Here, you can make use of a number of capabilities in COMSOL Multiphysics®. For example, there are methods to account for manufacturing variation effects without the need for very fine meshes. You can save resources by using analytical functions for electric fields, if you know the intrinsic features, such as the distances between capacitor plates, which are easy to determine with extrusion operators. Discuss such advanced techniques and ask questions of COMSOL technical staff in this Tech Café to increase your efficiency when modeling MEMS devices.

4:00 p.m.
Concluding Remarks

COMSOL Speakers

Mads J. Herring Jensen
COMSOL
Mads Herring Jensen joined COMSOL in 2011 and is the technical product manager for the Acoustics Module. Before starting at COMSOL, he worked in the hearing aid industry for five years as an acoustic finite element expert. Mads has a PhD in computational fluid dynamics from the Technical University of Denmark.
Phillip Oberdorfer
COMSOL
Phillip Oberdorfer is a technical marketing manager at Comsol Multiphysics GmbH. He helps produce webinar and technical content. Previously, he worked as an applications manager in technical support. Phillip received his PhD from the University of Göttingen, where he used COMSOL Multiphysics for a geothermal energy research project.
Thorsten Koch
COMSOL
Thorsten Koch is the managing director of Comsol Multiphysics GmbH. There, he worked as an applications engineer and was a member of the development team. He holds degrees in physics and applied mathematics, completing his PhD studies on 3D contractility measurements of living cells at the University of Erlangen-Nuremberg.
Lars Dammann
COMSOL
Lars Dammann has been an applications engineer at Comsol Multiphysics GmbH since 2016. He obtained his MSc in experimental solid-state physics at the University of Göttingen, where he studied the interaction of electrons and optical near fields using an ultrafast, low-energy electron diffraction experiment.
Maria Iuga-Römer
COMSOL
Maria Iuga-Römer is an applications manager at Comsol Multiphysics GmbH. Previously, she studied physics at the West University of Timișoara and received a PhD at the University of Würzburg. She worked at the Fraunhofer Institute for Silicate Research, simulating microstructural properties to develop and optimize ceramic materials.
Walter Frei
COMSOL
Walter Frei has been with COMSOL since 2008. He received his PhD in mechanical engineering from the University of Illinois at Urbana-Champaign, working on the optimization of photonic crystal microcavity lasers.
Jinlan Huang
COMSOL
Jinlan Huang is an applications engineer for vibrations and acoustics and instructs acoustics training courses. She received her PhD from Boston University, Department of Aerospace and Mechanical Engineering, investigating acoustic wave propagation in complex-tissue environments and ultrasound-induced tissue heating and bleeding control. She joined COMSOL in 2011.
Colas Joannin
COMSOL
Colas Joannin joined COMSOL France in 2017 as an applications engineer. He is an engineer from École Centrale de Lyon and holds a PhD in nonlinear dynamics, accomplished with the Safran Group.
Chien Liu
COMSOL
Chien Liu is a senior member of the technical team at COMSOL, working with the MEMS and Semiconductor modules. Previously, he worked in R&D at Polaroid and Zink Imaging, where he coinvented the Zero INK technology. Chien has a PhD from Harvard University in applied physics and a postdoctorate from Rowland Institute for Science.

Join COMSOL Day: MEMS

Log in or sign up to register. A COMSOL Access account is required to attend COMSOL Day: MEMS.
Forgot your Password?
You have successfully logged in. This page will refresh to complete your event registration.
You have successfully created a new COMSOL Access account. This page will refresh to complete your event registration.

COMSOL Day Details

Location

This event will take place online.