COMSOL Day: Microsystems
See what is possible with multiphysics simulation
Join fellow engineers and simulation specialists to learn about multiphysics simulations in applications that involve microsystem devices. Topics will cover modeling MEMS-based sensors and actuators, as well as optic, microacoustic, and piezoelectric devices.
We welcome both experienced COMSOL Multiphysics® users and those who are new to the COMSOL® software to attend COMSOL Day. The sessions will focus on modeling techniques in the respective application areas, and you will learn about the software features and best practices from applications engineers. Keynote speakers from industries based on or reliant on such devices will provide perspective on the importance of simulation to these applications.
View our schedule below and register for free today!
Modeling real-world MEMS devices and processes is only possible if multiphysics interactions are included. At small length scales, the design of resonators, gyroscopes, accelerometers, microspeakers, microphones, and actuators must consider the effects of multiple physical phenomena in their operation. These include, for example, electromagnetic-structure, thermostructure, and fluid-structure interactions, as well as damping effects. Numerous simulation users from the MEMS industry therefore use multiphysics simulation as a key element in their product development process.
During this session, the latest trend in modeling the behavior of MEMS components and applications will be investigated: You will learn how simulation specialists make their complex and high-fidelity multiphysics models available for other departments and for their customers.
Byoungyoul Park, National Research Council Canada
The design and analysis of a low-voltage large stroke (over 10 µm) MEMS Lorentz deformable mirror, which uses a rigid crossbar, serpentine spring, and thin membrane mirror, is presented. The rigid crossbar and flexible serpentine spring structure minimize the driving current and voltage by maximizing the generated Lorentz force. Designed actuators constitute hundreds or thousands of arrays, depending on the application, and are bonded to a thin-film mirror. The mirror surface can be transformed into various shapes by the Lorentz force generated on each actuator node, which can be used to compensate for distorted wavefronts caused by atmospheric turbulence in ground-based telescope applications. The proposed structure is modeled and studied using the COMSOL Multiphysics® software.
Modeling piezoelectric devices requires a multiphysics approach, where incorporating such models within the design process requires a better understanding of the interactions between structural materials, piezoelectric ceramics, and fluid damping. A more accurate solution for all involved physics reduces development time and prototyping costs. Join this session to gain insight into the most important simulation techniques when it comes to modeling piezoelectric devices.
Meshing microscopic geometries for the purpose of simulation can be challenging for several reasons. For example, widely different mesh sizes may be advantageous or even required from modeling domain to modeling domain. Alternatively, large directional dependencies on mesh accuracy, due to dimensional requirements or anisotropic behavior of the material parameters, need to be accounted for. Join this Tech Café to discuss the challenges of meshing MEMS and other microsystem devices with colleagues, while receiving useful tips from COMSOL technical staff.
Acoustic propagation in structures with submillimeter physical features is common in the components of consumer products like mobile devices, protective grills of loudspeakers, hearing aids, and perforates used in mufflers and sound insulation. To model this accurately, you need to include thermoviscous losses in your definition of the physics. In this session, you will be introduced to modeling techniques used to capture these effects and how to model nonlinear effects in microacoustics systems.
MEMS devices are designed and built in many configurations for a wide range of applications.
One fundamental aspect in the design of such devices is the use and manipulation of different materials. While smart materials such as piezoelectric, piezoresistive, shape memory alloy, and other materials are commonly used, some MEMS devices also incorporate engineered materials such as metamaterials, which exhibit unique electromagnetic or acoustic behavior.
Learn more about the implementation of various special material properties and discuss best practices with interested colleagues in this tech café.
Carl Meinhart, Numerical Design
Nearly all microfluidic devices to date consist of some type of fully enclosed microfluidic channel. The concept of "free-surface" microfluidics has been pioneered at UCSB over the past several years, where at least one surface of the microchannel is exposed to the surrounding air. Surface tension is a dominating force at the micron scale, which can be used to effectively control fluid motion. There are a number of distinct advantages to the free-surface microfluidic architecture. For example, the free surface provides a highly effective mechanism for capturing certain low-density vapor molecules. This mechanism is a key component (in combination with surface-enhanced Raman spectroscopy, i.e., SERS) of a novel explosive vapor detection platform, which is capable of sub-part-per-billion sensitivity with high specificity.
COMSOL Multiphysics® and the add-on MEMS Module contain all of the modeling components and features necessary for analyzing the combined mechanical and electrical behavior in devices on the microscale. This session will introduce the MEMS Module by summarizing its features and demonstrating examples that analyze MEMS-based sensors, actuators, and filters.
Viscous and thermal damping effects play a significant role in electrical, mechanical, and acoustic behavior at the dimension level of microsystems. This is inherently the case for MEMS devices. In this Tech Café, we will discuss the various damping processes when modeling such systems with colleagues and COMSOL engineers.
MEMS devices for measuring acceleration or orientation in space usually rely on the interaction between electrical and mechanical phenomena. As a consequence, a multiphysics approach often proves necessary to accurately model them. This session will demonstrate how COMSOL Multiphysics® allows you to easily set up such electromechanical models using built-in features in the software.
Scattering parameters, or S-parameters, are important targets for numerous simulation studies in electronic device development. In this Tech Café, we will discuss and demonstrate various methods of extracting S-parameters from microscale capacitive and inductive devices. In particular, an interdigitated capacitor example will be available to be modeled in 3D to start the discussion. This can be modeled using three different approaches and then simplified to 2D. These techniques can also be applied to other devices, such as SAW sensors, RF MEMS switches, resonators, and filters.
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