COMSOL Day United Kingdom
See what is possible with multiphysics simulation
Join fellow engineers and simulation specialists to learn about COMSOL Multiphysics®. Topics will cover an introduction to the software and its applications deployment products, major updates in version 5.6, summaries of various add-on modules, and demonstrations of modeling examples.
We welcome both experienced COMSOL Multiphysics® users and those who are new to modeling to attend this COMSOL Day. The sessions will focus on software benefits and features and best practices for modeling your applications. These will be provided by COMSOL technical staff and invited speakers who will also discuss perspectives on the importance of simulation to their respective industries.
View our schedule below and register for free today!
To start, we will briefly discuss the format of the day and go over the logistics for using GoToWebinar.
Learn the fundamental workflow of the COMSOL Multiphysics® modeling environment. This introductory demonstration will show you the process of transforming models into specialized simulation applications and distributing them with COMSOL Compiler™ and COMSOL Server™, application deployment products.
From Here to Ear: The Multiphysics Path of the Audio Signal
The path of the audio signal from a sound source to the listener's ear crosses several physical domains (electrical, mechanical, acoustical), and this makes COMSOL Multiphysics® the ideal simulation tool, as proven by its growing use in the electroacoustics industry. Bowers & Wilkins has been at the forefront of audio technology for more than 50 years; during this time, many of the key technologies embedded in its high-end systems have been improved and perfected with the help of FEM simulations. Join the seminar to see examples of the wide range of COMSOL® simulation tools applied to state-of-the-art, high-fidelity loudspeaker systems by Bowers & Wilkins.
Modeling the Risk of Electrostatic Discharge in Polymer Composite Pipes Used in Gas Applications
The transport of natural gas and particulates through nonmetallic pipes could lead to the accumulation of static charge on the inner surface of the pipe. Due to the nonconductive nature of the pipe walls, this charge is not dissipated and may create a significant risk of explosion, damage, and injury to persons should it exceed a certain limit and discharge suddenly. Moreover, if the charge conditions across the pipe wall result in an electric field that exceeds the dielectric strength of the pipe material, then the subsequent discharge can melt a hole through the pipe wall, a phenomenon known as pin-holing. This risk has to be properly quantified and mitigated in order to ensure safe utilization of nonmetallic pipes in natural gas services.
Current approaches to evaluating the risk of electrostatic discharge rely only on the determination of the flow regime (API/RP 2003 and NFPA 77), often using analytical approximations (e.g., Baker and Mandhane charts). If a mist regime is present, then the risk of electrostatic discharge is declared high. This approach can be overconservative, and mitigation methods to avoid a mist flow regime are difficult to implement.
Instead, in this work, a modeling approach combining heat transfer, computational fluid dynamics, and electrostatics has been developed to provide a quantitative assessment of the risk of electrostatic charge buildup in composite pipes used in natural gas transportation. The modeling approach has been validated in laboratory conditions to demonstrate its efficacy and used on real case scenarios from the field.
COMSOL Multiphysics® version 5.6 introduces many new features and benefits for all parts of your modeling workflow. This session will summarize many of the general updates and improvements within the core functionality of COMSOL Multiphysics®, from improved solvers and handling of CAD geometries to new graphics features. Major news will be presented, such as the introduction of four new modules, and important new features will be demonstrated.
Get a brief overview of the electromagnetic modeling features of COMSOL Multiphysics®, with a focus on the AC/DC Module, RF Module, Wave Optics Module, and Ray Optics Module.
This session will introduce you to the most important solver algorithms in COMSOL Multiphysics®. We will concentrate on improvements that ensure solvers are faster and more memory efficient, particularly for multicore and cluster computing. Further, we will look at newly incorporated domain decomposition methods and a new eigenvalue solver. Questions will be taken on these and other topics concerning the acceleration of convergence of your nonlinear multiphysics models.
Get a brief overview of using the Heat Transfer Module within the COMSOL® software environment. We will discuss conjugate heat transfer with the combination of heat transfer in solids and heat transfer in fluids, including thermal radiation effects. These phenomena could also be coupled with structural mechanics, chemical reactions, and particle tracing.
Learn about best practices when importing CAD geometries and meshes for analyses in COMSOL Multiphysics®. The minicourse will introduce tools in COMSOL Multiphysics® for defeaturing and removal of details from CAD geometries, as well as the necessary preparation of CAD geometries before import, including steps to identify and resolve errors originating from the CAD file.
Get an introduction to the capabilities of the COMSOL Multiphysics® software for modeling the interactions between acoustic waves and structural vibrations, including techniques for improving both model accuracy and runtime. Plus, learn about advanced postprocessing for acoustic waves.
The optimization of manufacturing processes, material choices, design dimensions, and operating conditions is inherent to any engineer’s decision making. In this session, we will demonstrate how optimization can be applied to your COMSOL Multiphysics® simulations using the Optimization Module. New and improved features introduced in version 5.6 will be summarized, including a new optimization solver. Questions are welcome and will be answered by COMSOL technical staff.