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Thermal contact resistance
Posted Jan 31, 2017, 12:09 p.m. EST Heat Transfer & Phase Change Version 5.0 1 Reply
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Hello
I am trying to model the contact resistance of two conforming surfaces. There are apparently two options to do so:
1. thermal contact in the Heat Transfer in Solids package.
2. Pair thermal contact from the Physics menu in the ribbon.
The modelling equations are the same and I did not observe any difference. The documentation is also not clear on this point. However, to make sure, I'd like to ask if there are any differences between these two options.
Your help would be greatly appreciated
Best
I am trying to model the contact resistance of two conforming surfaces. There are apparently two options to do so:
1. thermal contact in the Heat Transfer in Solids package.
2. Pair thermal contact from the Physics menu in the ribbon.
The modelling equations are the same and I did not observe any difference. The documentation is also not clear on this point. However, to make sure, I'd like to ask if there are any differences between these two options.
Your help would be greatly appreciated
Best
1 Reply Last Post Feb 1, 2017, 2:31 a.m. EST
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Posted:
7 years ago
Hello Mohamad,
The pair boundary conditions are different from the regular boundary conditions as they have to be applied to so called Identity Pairs. These pairs are created if you set the end node of the geometry sequence to "For Assembly" rather than the default "Form Union".
Check out the video here for more infomation about this topic:
www.comsol.de/video/form-union-form-assembly-geometry-finalization-methods
Regards,
Andreas
The pair boundary conditions are different from the regular boundary conditions as they have to be applied to so called Identity Pairs. These pairs are created if you set the end node of the geometry sequence to "For Assembly" rather than the default "Form Union".
Check out the video here for more infomation about this topic:
www.comsol.de/video/form-union-form-assembly-geometry-finalization-methods
Regards,
Andreas