Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

Modeling melting in Comsol 5.5

Please login with a confirmed email address before reporting spam

Hello everyone I'm trying to model melting due to laser as a heat source in Comsol 5.5. I have gon through many papers and most of them have suggested to model surface tension using Weak form. I have tried a lot and still struggling. I have tried alternative ways to model the same but I have not been able to achieve it. I have tried doing it using External Fluid Interface, Fluid Fluid Interface, Margoni Effect with mesh velocity, tried some weak comtribution equations also. I now want to impose this equation:

  • in the normal direction:

sigma * vector(n) = -Pext * vector(n) + kappa * gamma * vector(n)

  • in the tangential direction:

sigma * tangentialvector(t) = d(gamma)/d(T) * tangential.gradient(T) * vector(t)

I have tried several forms. But there are many issues like: I have two exposed boundaries. One at the top and the other at the bottom. So I want to model as the layer getting removed and then solidfy. But when I add surface tension on both boundaries they start moving towards each other.

Sorry for so long description. But I'm really stuck and want to learn this. Any help would be highly appreciated. I have already checked many models in Application Library and many papers to follow but couldnot achieve it.

Please help!!!!!! Thanks Harsh


0 Replies Last Post Mar 18, 2021, 8:14 a.m. EDT
COMSOL Moderator

Hello Harsh Goel

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.