Flat Heat Pipe
Application ID: 43841
Heat pipes are used in a wide range of applications for efficient cooling, for example in microelectronic systems, computer internals, and for large cooling devices in spacecraft industry. It combines the principles of heat conduction and phase change to get extremely efficient heat transfer between a cold and hot side.
This model shows the basic set-up for modelling the heat transfer mechanisms in a flat heat pipe including heat transfer in solids, fluids and porous media as well as laminar flow in the vapor core. The flow in the vapor core is induced by the difference in the saturation pressure between evaporator and condenser side. The induced mass flow results in a heat source/sink term due to latent heat release.
This approach can be used in other heat pipe configuration as well.
The model can analyze the influence of different geometry parameters and operating conditions but does not predict operating limits of the heat pipe.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.