Laser Heating of a Silicon Wafer with Ablation

Application ID: 28241

When modeling a manufacturing process, such as the heating of an object, it is possible for irreversible damage to occur due to a change in temperature. This may even be a desired step in the process.

With the Previous Solution operator, we can model such damage in COMSOL Multiphysics. Here, we will look at the “baking off” of a thin coating on a wafer heated by a laser.

This model example illustrates applications of this type that would nominally be built using the following products: