Laser Heating of a Silicon Wafer with Ablation
Application ID: 28241
When modeling a manufacturing process, such as the heating of an object, it is possible for irreversible damage to occur due to a change in temperature. This may even be a desired step in the process.
With the Previous Solution operator, we can model such damage in COMSOL Multiphysics. Here, we will look at the “baking off” of a thin coating on a wafer heated by a laser.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.