Application ID: 366
This example illustrates the ability to couple thermal, electrical, and structural analysis in one model. This particular application moves a beam by passing a current through it; the current generates heat, and the temperature increase leads to displacement through thermal expansion. The model estimates how much current and increase in temperature are necessary to displace the beam. Although the model involves a rather simple 3D geometry and straightforward physics, it provides a good example of multiphysics modeling.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.