The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
In electrosurgery, high-power AC current from a probe is driven into tissue in order to cut and coagulate it. The current causes rapid Joule heating near the tip, and as temperatures reach 100°C, water and blood vaporize and the tissue desiccates, enabling cutting or sealing. This ... Read More
In direct bonding, if the interface is not clean and particles are present, even particles on the micron scale can significantly degrade the bonding quality, resulting in large-area voids. This model demonstrates the simulation process of 3D D2W direct bonding, taking into account the ... Read More
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... Read More
PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ... Read More
