Heat-Sink Solution through Artificial Nanodielectrics for LED Lighting ApplicationN. Badi, R. Mekala
Department of Physics, Center for Advanced Materials, University of Houston, Houston, TX, USA
Department of Electrical & Computer Engineering, University of Houston, Houston, TX, USA
Thermally conducting but electrically insulating materials are needed for heat-sink LED lighting applications. We report on a cost effective and innovative method based on creating core-shell nanoparticles in polymer with aluminum (Al) nanoparticles as the high thermal conductivity core and ultrathin aluminum oxide (Al?O?) as a capping shell. The solid oxide shell around the Al core prevents agglomeration of Al nanoparticles. A coupled COMSOL heat transfer and AC/DC modules were used in the simulation. The mean effective thermal conductivity seems to exceed the value of 100W/m·K with an electrical permittivity of 52 at 12% Al-Al?O? core-shell nanoparticles loading in a polyvinylidene fluoride polymer nanocomposite. These results are considered outstating but they need to be validated experimentally.