Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMMG. Petrone, and G. Cammarata
University of Catania, Catania, Italy
It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM modules vertically arranged. Once the numerical model is validated, it is exploited in order to produce useful indications for thermal design of those equipments, such as non-dimensional convective heat transfer coefficients.