COMSOL Conference 2013

Simulation Methods and Teaching

The simulation and teaching methods described in the papers, posters, and presentations on this page cover a range of topics, including: implementing features and interfaces for specific applications, sharing practices and experiment techniques, and the use of certain mathematics and models in the software.

Coupled PDEs with Initial Solution from Data in COMSOL Multiphysics®

M. K. Gobbert, X. Huang, S. Khuvis, S. Askarian, B. E. Peercy

University of Maryland - Baltimore County, Baltimore, MD, USA

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda1, S. Birla2, J. Subbiah2, H. Thippareddi1

1Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
2Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Inductive Conductivity Measurement of Seawater

R. W. Pryor

Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

Food Cooking Process. Numerical Simulation of the Transport Phenomena

B. Bisceglia, A. Brasiello, R. Pappacena, R. Vietri

University of Salerno, Department of Industrial Engineering, Fisciano (SA), Italy

Dynamic Characterization and Mechanical Simulation of Cantilevers for Electromechanical Vibration Energy Harvesting

N. Alcheick, H. Nesser, H. Debeda, C. Ayela, I. Dufour

Univ. Bordeaux, IMS Lab, Pessac, France

Design of Pressure Measuring Cells Using the Unified Material Law

P. Aguirre, F. Figueroa

Sensor Technik Wiedemann GmbH, Kaufbeuren, Bayern, Germany

Undergraduate Studies of Supersonic Flow from a Converging-Diverging Nozzle

K. Stein, N. Gessner, R. Peterson, A. Wiedmann

Department of Physics, Bethel University, St. Paul, MN, USA

Simulating Organogenesis in COMSOL Multiphysics®: Parameter Optimization for PDE-based Models

D. Iber1, D. Menshykau2, P. Germann2, L. Lermuzeaux2,3

1D-BSSE, ETH Zurich, Switzerland, SIB, Basel, Switzerland
2D-BSSE, ETH Zurich, Basel, Switzerland
3Department of Bioengineering, University of Nice-Sophia Antipolis, Nice, France

SD Numerical Simulation Technique for Hydrodynamic Flow Gas-Solids Mixing

I. Mantilla1, S. De Vicente2

1National University of Engineering, Lima, Perú
2Polytechnic University of Madrid, Madrid, Spain

Looking for the Origin of Power Laws in Electric Field Assisted Tunneling

H. Cabrera, D.A. Zanin, L.G. De Pietro, A. Vindigni, U. Ramsperger, D. Pescia

Laboratory for Solid State Physics, ETH Zurich, Zurich, Switzerland

The Influence of Core Shape and Material Nonlinearities to Corner Losses of Inductive Element

M. Puskarczyk, B. Jamieson, W. Jurczak

ABB Corporate Research Center, Kraków, Poland

Multigrid Implementation in COMSOL Multiphysics® - Comparison of Theory and Practice

W. Joppich

University of Applied Sciences, Sankt Augustin, Germany

COMSOL Multiphysics® Simulations of Cracking in Point Loaded Masonry with Randomly Distributed Material Properties

A.T. Vermeltfoort, A.W.M. van Schijndel

Eindhoven University of Technology, Eindhoven, The Netherlands

Harmonic Simulation of Viscoelastic Polymer Microcantilever for Electrostrictive Energy Harvesters

N. Alcheikh, C. Ayela, I. Dufour

Univ. Bordeaux, IMS Lab, Pessac, France.

Moisture Risks in Multi-layered Walls - Comparison of COMSOL Multiphysics® and WUFI®PLUS Models with Experimental Results

A. Ozolins, A. Jakovics

Laboratory for Mathematical Modelling of Technological and Environmental Processes, Riga, Latvia

Several Benchmarks for Heat Transfer Problems in COMSOL Multiphysics®

S. Titarenko

University of Leeds, Leeds, United Kingdom

Numerical Experiments on Deconvolution Applied to LES in the Modeling of Turbulent Flow

O. Toscanelli, V. Colla

Scuola Superiore S. Anna, Pisa, Italy

Simulation and Performance Analysis of Nanowire Design with Different Variants

Boopathi S, Ms.E.Malar, Deepan Chakravarthi P

Department of Biomedical Engineering, PSG College of Technology, Coimbatore, Tamil Nadu, India

Fracture on Circuit Board Internal Layers Due to Thermal Stress on Soldered Pins

F. Figueroa, P. Aguirre

Sensor Technik Wiedemann GmbH, Kaufbeuren, Germany

Water Quality Model for Brewster Lake

Z. Aljobeh, G. Argueta

Valparaiso University, Valparaiso, IN, USA

Accelerating R&D with COMSOL: A Personal Account

Erik Birgersson

Department of Chemical and Biomolecular Engineering, National University of Singapore, Singapore, Singapore


ISBN: 978-0-9910001-5-9
ISSN: 2372-2215