Die-to-Wafer (D2W) Direct Bonding Involving a Dust Particle
Application ID: 152051
In direct bonding, if the interface is not clean and particles are present, even particles on the micron scale can significantly degrade the bonding quality, resulting in large-area voids. This model demonstrates the simulation process of 3D D2W direct bonding, taking into account the initial warpage of the die and the wafer, as well as the influence of tiny particles on the propagation of the bonding wave.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.
