Thermal Warpage of PCB
Application ID: 152001
PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ultimately resulting in board warpage.
This model, based on the PCB to Material Data add-in, simulates the warpage and residual stress of the PCB under the reflow soldering temperature profile.
Note: The material specifications of the viscoelastic material are based on the paper: Jeong-Hyeon Beak, Dong–Woon Park, Gyung-Hwan Oh, Dong–Ok Kawk, Simon S. Park, Hak-Sung Kim, Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package, Materials Science in Semiconductor Processing 148 (2022) 106758
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.
