Wafer Vacuum Adsorption by a Grooved Chuck
Application ID: 152121
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, and initial wafer warpage on adsorption performance.
This example presents a coupled fluid-structure-contact model that captures the interaction between the pressure distribution in the chuck grooves and wafer deformation during adsorption. The model provides quantitative insight into the chucking mechanism and serves as a basis for optimizing groove design.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.
