The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Droplet evaporation is ubiquitous in everyday life, and is essential in many industrial processes such as ink-jet printing, cleaning or coating of surfaces, and phase change heat transfer. In this model, a water droplet placed on a solid substrate evaporates in air. We solve the ... Read More
This app demonstrates the following: Visualizing material appearance, color, and texture Showing info below the graphics about geometry parameters, results and performance depending on the selected plot action Thermoelectric coolers are widely used for electronics cooling in various ... Read More
This model treats the free convection and heat transfer of a glass of cold water heated to room temperature. Initially, the glass and the water are at 5 °C and are then put on a table in a room at 25 °C. The nonisothermal flow is coupled to heat transfer using the Heat Transfer module. Read More
This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to ... Read More
The level set method is well suited for problems with moving boundaries in which the geometry’s topology changes with time. A bubble of oil that travels up through water and finally merges with oil at the top causes this kind of topology change. For problems where the topology is ... Read More
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Read More
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Read More
Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... Read More
This example simulates 3D unsteady laminar flow past a cylinder in a channel. The inflow velocity profile is time-varying. The lift and drag coefficients are computed, and results show good agreement with those published in the literature. Read More
Centrifugal pumps are used in various applications and can be found in many industries. The size of the pump in this model is typical for automotive applications. This model shows how to set up rotating machinery simulations using the frozen rotor approximation for modeling centrifugal ... Read More