Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

A Modeling Study of Diffusion Wear of Carbide Tools in Titanium Machining

M. Crosskey and E. Gutierrez-Miravete
Department of Engineering and Science, Rensselaer at Hartford, Hartford, CT, USA

COMSOL Multiphysics has been used to model the temperature distribution produced inside a tool as a result of the forces and friction involved in a cutting process, along with the resulting diffusional flow of cobalt binder from the tool.The model uses as the input tool rake and flank face temperatures determined either experimentally or from other models, and then proceeds to couple the thermal ...

FEM Simulation of Nanotubes Manipulation using Dielectrophoreseis

V. Mathur1, J. Li1, J. Therrien2, and W. D. Goodhue1
1Photonics Center, Department of Physics and Applied Physics, University of Massachusetts, Lowell, MA, USA
2Department of Electrical Engineering, University of Massachusetts, Lowell, MA, USA

Several methods have been demonstrated for depositing nanotubes on microstructures, ranging from using an atomic force microscope (AFM) tip for single tube manipulation to chemically pre-patterning the substrate. However, these techniques have a very low yield and poor reproducibility. Sorting techniques involving filtration and ultrasonication face similar issues. Recently, electric field ...

Magnetic Particle Motion in a Gradient Field

U. K. Veeramachaneni, and R. Lloyd Carroll
Department of Chemistry, West Virginia University, Morgantown, WV, USA

A model is presented for predicting the motion of magnetizable particles in a gradient magnetic field, considering the effects of fluidic forces on particles in the micro system.The micro system consists of a gradient magnetic field (such as that produced by a solenoid or permanent magnet), a magnetizable particle, and the fluid surrounding the particle (water).Particles located in the gradient ...

Modeling of Low Pressure Magnetron Plasma Discharge

F. Jimenez, S. D. Ekpe, and S. K. Dew
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB, USA

The plasma characteristics of a low pressure plasma discharge are dependent on the process conditions in a complicated manner. In order to understand this dependence, a comprehensive model, which takes into consideration the effects of the E x B field and gas heating on the transport of plasma particles, is required.In this work, a Monte Carlo - fluid - Poisson hybrid model is used in describing ...

3D Modeling of Impedance Spectroscopy for Protein Detection in Nanoneedle Biosensors

H. Esfandyarpour1,2, A. Maiyegun1, and R. W. Davis2
1Center for Integrated Systems, Department of Electrical Engineering, Stanford University, Stanford, CA, USA
2Stanford Genome Technology Center, Stanford, CA, USA

We present a preliminary investigation of a Nanoneedle biosensor as an ultra sensitive and localized impedance biosensor using COMSOL.This preliminary study was performed to prove the feasibility of the impedance biosensor for detection of protein or nucleic acids. By monitoring the change in capacitance and impedance of this structure, we aim to characterize and classify biological species such ...

Thermal Modeling of A Friction Bonding Process

J. Dixon1, D. Burkes2, and P. Medvedev2
1Clemson University, Clemson, SC, USA
2Idaho National Laboratory, Idaho Falls, ID, USA

A three-dimensional heat transfer model of the friction bonding (FB) process implementing shallow pin penetration for cladding monolithic nuclear fuel foils is presented.Temperature distribution during the FB process as a function of fabrication parameters such as weld speed, tool load, and tool rotational frequency are predicted. Model assumptions, settings, and equations are described in ...

Modeling of the Quantum Well and Cascade Semiconductor Lasers using 8-Band Schrödinger and Poisson Equation System

M. V. Kisin
Electrical Engineering, State University of New York, Stony Brook, NY, USA

An eight-band quantum mechanical model of the electron and hole energy spectrum, in nanoscale semiconductor heterostructures with phenomenological boundary conditions for the charge carrier multicomponent effective wave function at the heterostructure interfaces, has been formulated using symmetry.COMSOL programs based on this model were developed and used for design and simulation of ...

COMSOL-Based Numerical Analysis of The Electric Field Distribution During Electrospinning and Piezo-response Imaging of Ultra-Fine Lead Zirconate Titanate Fibers

Y. Wang and J. Santiago-Avilés
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA

In this paper, we present our results on synthesizing micro and nanoscopic lead zirconate titanate (PZT) fibers using electrospinning. Furthermore, the PZT fibers have been characterized using the piezo-response imaging (PRI) technique originally developed for the characterization of piezoelectric thin films.As both electrospinning and PRI work by virtue of electric field, the desired spatial ...

A Survey of Multiphysics Applications for Materials and Processes

John Tanski
Staff Engineer
Los Alamos National Laboratory
Los Alamos, NM

In this presentation, the following modeling applications are considered: Heat treatment of carbon fiber-epoxy parts Growth and contact of corrosion spot Gas saturation in epoxy cartridges Design of mechanical assembly for corrosion All models are accompanied with a description of the physics, problem formulation as well as results from ...

Time Domain Analysis of Large-Signal Circuit-Based Fully Distributed Model for High-Frequency, Multiple-Finger FETs

M. Waliullah1, S. Goodnick2, S. M. El-Ghazaly3, A. Cidronali4, and C. Toccafondi4
1Intel Corporation, Folsom, CA, USA
2Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA
3Department of Electrical Engineering, University of Tennessee, Knoxville, TN, USA
4Department of Electronics and Telecommunication Engineering, University of Florence, Italy

A general fully-distributed equivalent circuit model for high frequency multiple finger power FETs is presented.In the multiple finger equivalent circuit model, the effects of electromagnetic (EM) wave propagation along the width of each finger and gate feeding line are modeled by distributed transmission line parameters. The generalized multiple finger large signal model is solved in the time ...

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