See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
Heat and Mass Transfer Modelling in Lyophilization Using COMSOL Multiphysics®
Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... Read More
Numerical Simulation of Melt Hydrodynamics in Laser Micro Processing using COMSOL Multiphysics®
Laser material processing at micro-meter domain can be used for a plethora of applications such as micro drilling, micro welding, micro cutting, micro-texturing as well as micro polishing. These processes are governed by the time varying, complex melt hydrodynamics courtesy of melting ... Read More
Stiffness Analysis of Stabilizer Bar
Anti-roll bar or stabilizer bar is a critical component for vehicle’s roll stiffness. This plays a major role in cornering and overall vehicle dynamics. Various methods can be used to calculate stiffness of roll bar at design stage. A simple formula-based method is used calculate the ... Read More
Design and Simulation of a Dual Axis Thermal Accelerometer using Single Axis Structure
An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... Read More
Simulation of Drying Process During Fabrication of Lithium-Ion Battery Porous Electrode
Lithium ion battery electrodes are porous composite film made up of two or three different types of solid material. Typically using the fabrication of the electrode, the solid powders (active material, binder and in most cases a conductive active) are dispersed in a solvent like NMP and ... Read More
FEM Simulation of Interdigitated Electrodes (IDEs) Device
In this, FEM simulation of the interdigitated electrodes (IDEs) device using COMSOL Multiphysics® is presented. In this study, the effect of meshing sequence on the performance of IDEs device was evaluated using normal as well as adaptive mesh refinement. The key parameters such as of ... Read More
Comparative Numerical Simulation of Masonry arch with Different Interlocking Pattern
Arches being one of the most aesthetic and stable form of structural elements, have been constantly used since hundreds of years in various form of constructions be it buildings, bridges or any other structural system. Though, common use of reinforced concrete framed structures has ... Read More
Numerical Study of Millimeter-Scale Magnetorheological Elastomer Robot for Undulatory Swimming
Numerical investigations of magnetorheological elastomer millimeter-scale robots capable of undulatory swimming under magnetic body torques are realized for the first time in low Reynolds number condition using AC/DC, CFD, Structural Mechanics modules in COMSOL Multiphysics®. The ... Read More
Analysis of the Material Removal Rate and Smoothing Effect of Active Fluid Jet Polishing
Active fluid jet polishing is a sub-aperture polishing process used in the optical fabrication of complex surfaces. Correction of surface irregularities during the polishing process is a challenging process. Quality of optical surface depends on smoothing action during fine and ... Read More
Electronic Thermal Control using Heat Sink for Chip Cooling under Forced Convection
This paper presents numerical investigation of electronic thermal control using heat sink for integrated circuit (IC) chip cooling under forced convection in a horizontal channel. Steady state, three dimensional, incompressible, laminar forced convection cooling of chip attached with ... Read More