See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Computer simulation is mandatory for the optimization of electromagnetic devices. Here we concentrate on two classes of devices operating in the MHz and GHz range, namely microwave ovens and TEM cells for electromagnetic compatibility testing. In particular we concentrate on the issue ... Read More
This paper addresses one of the major challenges in water-flooded oil reservoirs, which is early water breakthrough due to the presence of high permeable layers in the media. COMSOL Multiphysics is used to model two phase (water and oil) flow in dual-permeability porous medium at micro ... Read More
Grating-assisted optical coupling into long-range modes of strip plasmonic waveguides is analyzed by a 3D numerical simulation with COMSOL Multiphysics. We used the RF Module and its scattering formulation. A comparison with results obtained using the common 2D approximated analysis is ... Read More
This work focuses on the application of multiphysics finite element simulations in the manufacturing and application of high power ultrasonic machines. Industries providing big power ultrasonic solutions as in cleaning, welding, sonochemistry and cutting fields, already apply the finite ... Read More
In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for ... Read More
It is now a well known that the next generation devices in many fields of the semiconductor industry will be based on 3D architectures. In this framework, low thermal budget annealing technological solutions are required. For many applications, either in the field of sensors, ... Read More
COMSOL, adding SPICE® elements into its FEM, gives the possibility of a direct modeling of oscillators: triode and load are FEM described while all the other components of the circuit are just simulated using SPICE®. The modeling is not a straight application of any module but needs the ... Read More
In this work, we present a number of scoping calculations that have been carried out to design an in-situ redox experiment (Figure 1) focused on assessing potential changes in the pH and redox conditions and in the buffering capacity of the Olkiluoto bedrock (i.e. the site for the ... Read More
This abstract addresses the effect of scaling in air gap MOSFETs and determination of functional relationship between scaling parameter and sensitivity, frequency response. The modelling of the MOSFET and its simulations has been carried out using COMSOL Multiphysics. An air Gap MOSFET ... Read More
The MEMS microphone is also called microphone chip or silicon microphone.The pressure sensitive diaphragm is etched directly into a silicon chip by MEMS techniques and is usually accompanied with integrated preamplifier. Most MEMS microphones are variants of the condenser microphone ... Read More