See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
The MEMS microphone is also called microphone chip or silicon microphone. The pressure sensitive diaphragm is etched directly into a silicon chip by MEMS techniques and is usually accompanied with integrated preamplifier. Most MEMS microphones are variants of the condenser microphone ... Read More
This paper presents a novel design of single-bit RF MEMS phase shifter. The basic novelty introduced for phase shifter design in this case, is by scaling down of the lateral dimensions of the conventional RF MEMS shunt switch by 10 times. The Mechanical and Electromechanical analysis ... Read More
The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL Multiphysics® to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate ... Read More
The simulation of the piezoelectric actuation of the micro-cantilever is presented. Lead Zirconate Titanate (PZT) was chosen for the device fabrication design, due to its thin film processing flexibility. Four layers compose the cantilever structures presented in this work: PZT ... Read More
This paper presents an analysis approach of multicondcutor quasi-TEM lines transmission interconnect in a single dielectric region and multimode waveguides using the finite element method (FEM). FEM is especially suitable and effective for the computation of electromagnetic fields in ... Read More
In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... Read More
Development of very high speed integrated circuits is currently of great interest for today\'s technologies. This paper presents the quasi-TEM approach for the accurate parameters extraction of multiconductor transmission lines interconnect in single, two, and three-layered dielectric ... Read More
In our experiments with manipulating cells with DEP, we noted that some cells are constantly spining. By hypothesing that the cell spining is caused by the non-circular shape of the cell body and the off-centered location of its nucleus and that the rotation direction depends on the ... Read More
The majority of electrical machines are designed to produce the rotary motion, there by exploiting the blessing of circularity which man has enjoyed since the discovery of the wheel. Electromagnetic forces may also be employed to produce the linear motion resulting in linear motion ... Read More
3D FEM simulation of millimeter-scale, complex electro-optically induced waveguide based devices demands the use of grids with more than several million nodes. Hence the simulation could take substantial time and require large amounts of available memory. This paper presents a ... Read More